Sn晶须,tin whisker
1)tin whiskerSn晶须
1.Study on tin whisker growth of SnAgCuLa solder alloy surface;SnAgCuLa钎料合金表面Sn晶须的生长研究
2.Study of tin whisker growth accelerated by rare earth Y稀土Y加速Sn晶须生长规律
英文短句/例句

1.CROSS SECTION CHANGING GROWTH PHENOMENON OF Sn WHISKER IN Sn-3.8Ag-0.7Cu-1.0Er LEAD-FREE SOLDERSn-3.8Ag-0.7Cu-1.0Er无铅钎料中Sn晶须变截面生长现象
2.Formation of Sn whiskers from ball milled powder at room temperature室温下球磨粉体中Sn晶须的自发生长
3.FORMATION OF WHISKER AND HILLOCK IN Cu/Sn-58Bi/Cu SOLDERED JOINT DURING ELECTROMIGRATIONCu/Sn-58Bi/Cu焊点在电迁移过程中晶须和小丘的生长
4.A Study on Hypoeutectic Sn-Zn Alloys as Lead-free Solders;亚共晶Sn-Zn合金无铅电子焊料研究
5.Study on the Non-eutectic Sn-Bi Solders with Low Melting Point;Sn-Bi系低熔点非共晶无铅焊料的研究
6.Research on the Directionally Solidified Microstructure of Cu-Sn Peritectic Alloys;Cu-Sn包晶合金定向凝固组织研究
7.Tin Segregation Behavior to Grain-Boundary and the Hot Ductility of Low Carbon Steel;Sn的晶界偏聚行为与低碳钢的热塑性
8.Crystal Growth Kinetics of Cerium-based Sn-containing OxidesCe基含Sn氧化物晶粒长大动力学
9.Properties of Sn-0.65CuX modified hypoeutectic solder in nelting stateSn-0.65CuX亚共晶改性钎料的液态性能
10.Influence of Magnetic Field on Lamellar Eutectic of Pb-Sn Alloy磁场对Pb-Sn合金层状共晶生长的影响
11.Corrosion Resistance of Ternary Ni-Ta-Sn Amorphous AlloyNi-Ta-Sn非晶合金的耐腐蚀性能
12.Rapid Growth of Pb-Sb-Sn and Pb-Sn-Zn Ternary Eutectics under Substantial Undercooling Conditions;深过冷条件下Pb-Sb-Sn和Pb-Sn-Zn三元共晶的生长规律研究
13.Tin Whisker Growth of Sn and SnPb Thin FilmsSn及SnPb薄膜表面锡须生长研究
14.Microstructure and Properties of Rapidly Solidified Cu-Sn Hypoperitectic Alloys;快速凝固Cu-Sn亚包晶合金的微观结构与性能
15.Grain Boundary Character Distributions of Rolled and Annealed Pb-Ca-Sn-Al Alloy;Pb-Ca-Sn-Al合金轧制退火晶界特征分布研究
16.Effect of Grain Boundary Segregation of Residual Elements Cu-As-Sn on Intergranular Embrittlement Fracture of Low Alloying Steel低合金钢残余元素Cu-As-Sn的晶界偏析对晶间脆性断裂的影响
17.Separation of Intermetallic Compounds in the Microstructure of Eutectic Sn-Ag-Zn Solder Solidified at Different Cooling Rates;宽冷却速度下共晶Sn-Ag-Zn焊料组织中金属间化合物的析出
18.Influence of Tramp Elements Arsenic, Tin and Antimony Segregation to Grain Boundary on Hot Ductility of CC Steels;残留元素As、Sn、Sb的晶界偏聚对连铸钢热塑性的影响
相关短句/例句

Sn whiskerSn晶须
1.Formation of Sn whiskers from ball milled powder at room temperature室温下球磨粉体中Sn晶须的自发生长
2.0Er solder alloy are oxidized when exposed in air,and it was found that Sn whiskers can rapidly grow on the oxidized ErSn_3.暴露于空气中ErSn_3将发生氧化,同时在其表面会出现Sn晶须的快速生长现象。
3)Sn whiskerSn须
1.Relations between the chemical composition of Sn finish and Sn whisker growth under temperature cycling;温度循环条件下电镀液配方对镀层Sn须生长的影响
2.Sn whisker growth in TC conditions had in a high rate,a high density and a uniform length.采用TO220封装的电子元件,研究了在温度循环条件下,元件Cu引脚上纯Sn镀层的Sn须生长行为。
4)Sn whisker growthSn须生长
1.With lead-free requirement and size miniature in electronic product field,Sn whisker growth becomes a more serious problem in electronic packaging interconnecting and affects electronic products reliability and security.随着电子产品行业的无铅化以及其尺寸的微型化,在电子产品的封装互连中,Sn焊料凸点的Sn须生长成为制约电子产品的可靠性和使用安全性的一大瓶颈。
5)whisker[英]['w?sk?(r)][美]['w?sk?]晶须;触须
6)whisker[英]['w?sk?(r)][美]['w?sk?]晶须
1.Research on the preparation of basic magnesium sulfate whisker with organic acid by hydrothermal method;添加有机酸水热法制备碱式硫酸镁晶须的研究
2.Preparation of magnesium oxide whisker from basic magnesium sulfate by sintering method;碱式硫酸镁烧结法制备氧化镁晶须
3.Antistatic performance of ZnO whisker in polyacrylonitrile(PAN) fiber;渗入氧化锌晶须的聚丙烯腈纤维的抗静电性
延伸阅读

多晶莫来石晶须(纤维)分子式:CAS号:性质:莫来石相为主晶相的多晶纤维。化学成分为Al2O3 72%~77%,SiO222%~17%,B2O3 3%~5%,P2O51.5%~3.0%。纤维直径2~7μm,纤维长度20~125μm。使用温度1350℃。多采用溶胶-凝胶法制造。主要用作补强填料,也可作为轻质、隔热保温材料使用。