1)wrapper[英]['r?p?(r)][美]['r?p?]封装器
1.A technique of converting web documents into component based on wrapper一种基于封装器的Web文档构件化技术
2.Aiming at this problem,this paper designs four kinds of wrappers,which let these middlewares run under secure environment,and provides the control of good granularity among the middlewares,the middleware and other system resources.软件系统采用的中间件安全性不高,针对该问题设计4种封装器,确保中间件在安全环境下执行,为中间件之间、中间件和其他系统资源之间的交互提供细粒度控制。
英文短句/例句
1.The primitive data types also have "wrapper" classes for them.主数据类型也拥有自己的“封装器”（wrapper）类。
2.A technique of converting web documents into component based on wrapper一种基于封装器的Web文档构件化技术
3.Moisture Absorption Property of Material and Moisture&Thermal Affects on Package's Reliability封装材料的吸湿特性及湿、热对封装器件可靠性的影响
4.Front Oil Seal Installer 6635前油封安装器6635
5.cask-filling, closing, sealing or labeling cachine用于桶装填、封口、密封或贴标签的机器
6.Analysis on the Relation between EMC Property and Packaging Defect浅析环氧塑封料性能与器件封装缺陷
7.box-filling[and making /filling, closing, sealing or labeling machine ]箱装填[及制造／装填、封口、密封或贴标签的机器]
8.Packing containers-Closure of drumsGB13251-1991包装容器钢桶封闭器
9.jar-filling, closing, sealing or labelling machine, industrial广口瓶装填、封口、密封或粘标签的机器、工业用
10.Seal and Anchor Performance Test Installment Research of Packer封隔器的密封与锚定性能测试装置研究
11.Effect of Hydrogen on the Reliability of Microelectronic Devices氢对金属封装密封元器件可靠性的影响
12.Because the containers are sealed and controlled,因为集装箱是密封的和由机器人控制，
13.screw casing anchor packer用螺纹装置撑开及收缩的套管封隔器
14.The containers loaded with the dough are hermetically closed.装药团的容器应紧密密封。
15.Study on CFRP Encapsulating Fiber Bragg Grating Sensor;碳纤维复合材料封装FBG传感器研究
16.Research on the Package of Humidity Sensor Compatible with CMOS Technology;CMOS兼容湿度传感器封装的研究
17.Packing Technology of High Temperature Pressure TransducerMEMS耐高温压力传感器封装工艺
18.Device level vacuum packaging technologies of MEMS gyroscopesMEMS陀螺仪器件级真空封装技术
相关短句/例句
device packaging器件封装
3)encapsulator封装器，密封器
4)micro-device packaging微器件封装
5)sensor packaging传感器封装
6)small outline device小封装器件
延伸阅读
Assembly晶粒封装以树酯或陶瓷材料，将晶粒包在其中，以达到保护晶粒，隔绝环境污染的目的，而此一连串的加工过程，即称为晶粒封装（assembly）。封装的材料不同，其封装的作法亦不同，本公司几乎都是以树酯材料作晶粒的封装，制程包括：芯片切割→晶粒目检→晶粒上「架」（导线架，即lead frame）→焊线→模压封装→稳定烘烤（使树酯物性稳定）→切框、弯脚成型→脚沾锡→盖印→完成。以树酯为材料之ic，通常用于消费性产品，如计算机、计算器，而以陶瓷作封装材料之ic，属于高性赖度之组件，通常用于飞弹、火箭等较精密的产品上。
