1)Sem-ODM语义封装
1.We will show how the idea of Semantic Binary Object-Oriented Data Model (Sem-ODM) plays a key role in construction of the system.本文介绍了以语义封装技术为基础的多源数据库查询的一般框架AHSSM(Architecture of Heterogeneous System based on Semantic Modeling),论述了Sem-ODM(Semantic Binary Object-Oriented DataModel)建模方法及它在AHSSM框架中所起到的重要作用。
2)closed semantic tree封闭语义树
3)assembly semantics装配语义
1.The paper presented the requirements and characteristics of the assembly model that uses the DMU,analyzed assembly constraint relations and represented assembly relations using assembly connection diagrams which contain assembly semantics.本文提出了基于数字样机的装配模型的需求和特性,分析了装配约束关系,采用包含装配语义的装配连接图表达装配关系,进行了装配层次划分。
2.According to the process from collection of users requirements, conceptual design and detailed design, modeling to assembly, after the extraction and classification of the complicated domain knowledge, we put forward three layers of semantics as design semantics, modeling semantics and assembly semantics, so more domain knowledge can be used in the process of design and involved in the fi.在现有三维CAD系统的基础上 ,从用户需求、产品设计、零件建模、部件装配各个阶段入手 ,将其中蕴含的行业知识加以分类、提取、抽象 ,形成设计语义、建模语义和装配语义 ,使虚拟样机在建立过程中能够利用并且包含更多的行业知识。
英文短句/例句
1.BNF language and principle semantic is used to express behavior structure.以钻机的模块为例,借助装配语义说明如何实现行为结构到装配结构的转化。
2.Tolerance Semantic Modeling for Zero-Allowance Assembly支持无余量装配的容差语义建模技术研究
3.Research on Intelligent Assembly and Craft Resource Management System Based on Semantics;基于语义的智能装配与工艺资源管理系统研究
4.Design Technology Research of Product Assembly Based on Semantics in VRML Environment;VRML环境下基于语义的产品装配设计技术研究
5.Technologies of Assembly Sequence Evaluation基于工程语义的装配顺序快速规划与评估
6.Reasoning method based on semantics for virtual assembly operation虚拟装配操作中基于语义的推理方法研究
7.On the Collocative Meaning of Words ──Also on Leech s Theory of Collocative Meaning;论词的搭配语义——兼评Leech的搭配语义观
8.Semantic Types of Idioms and their Restrictions on Word-Meaning Collocation;成语语义类型及其对词汇──语义搭配的限制
9.Programs can be written by assembling sets of these predefined objects in far less time than is possible using conventional procedural languages.撰写程序有如装配那些预先定义的对象,所需的时间远比传统程序语言要少得多。
10.Pragmatic Function and Aesthetics Meaning of Zeugma;英语轭式搭配的语用功能及美学意义
11.Cognitive Context and Meaning Inference of Supper-collocative Phrases;认知语境与超常搭配词组的语义推导
12.Fuzzy Matching Technique by Sentence Skeleton in Semantic Collation System语义校对系统中的句子语义骨架模糊匹配算法
13.The Study and Implementation of Semantic Matching Algorithms in Semantic Web Serivces语义Web服务语义匹配算法的研究与实现
14.Fitting artificial eye on the atrophied eye of the teenager and children.少年儿童眼球萎缩的义眼装配分析
15.English Collocation Deviance and Its Semantic Function in Figure of Speech;英语修辞格中词语异常搭配及其语义功能
16.A Corpus-based Study of the Collocation and Semantic Prosody of Some Verbs Indicating Changes基于语料库的“改变”类词语搭配和语义韵考察
17.Research of Web Services Discovery and Matchmaking Based on Semantic;基于语义的WEB服务发现与匹配的研究
18.The Research of Semantic Based Web Services Discovery;基于语义Web的服务匹配机制的研究
相关短句/例句
closed semantic tree封闭语义树
3)assembly semantics装配语义
1.The paper presented the requirements and characteristics of the assembly model that uses the DMU,analyzed assembly constraint relations and represented assembly relations using assembly connection diagrams which contain assembly semantics.本文提出了基于数字样机的装配模型的需求和特性,分析了装配约束关系,采用包含装配语义的装配连接图表达装配关系,进行了装配层次划分。
2.According to the process from collection of users requirements, conceptual design and detailed design, modeling to assembly, after the extraction and classification of the complicated domain knowledge, we put forward three layers of semantics as design semantics, modeling semantics and assembly semantics, so more domain knowledge can be used in the process of design and involved in the fi.在现有三维CAD系统的基础上 ,从用户需求、产品设计、零件建模、部件装配各个阶段入手 ,将其中蕴含的行业知识加以分类、提取、抽象 ,形成设计语义、建模语义和装配语义 ,使虚拟样机在建立过程中能够利用并且包含更多的行业知识。
4)Semantic Wrap语义包装
5)inter-module assembly semantic模块间装配语义
6)Semantic Web service packaging语义Web服务包装
延伸阅读
Assembly晶粒封装以树酯或陶瓷材料,将晶粒包在其中,以达到保护晶粒,隔绝环境污染的目的,而此一连串的加工过程,即称为晶粒封装(assembly)。封装的材料不同,其封装的作法亦不同,本公司几乎都是以树酯材料作晶粒的封装,制程包括:芯片切割→晶粒目检→晶粒上「架」(导线架,即lead frame)→焊线→模压封装→稳定烘烤(使树酯物性稳定)→切框、弯脚成型→脚沾锡→盖印→完成。以树酯为材料之ic,通常用于消费性产品,如计算机、计算器,而以陶瓷作封装材料之ic,属于高性赖度之组件,通常用于飞弹、火箭等较精密的产品上。