多芯片组件,MCM英语短句,例句大全

多芯片组件,MCM
1)MCM多芯片组件
1.Research on the Failure Rate Prediction for MCM;多芯片组件MCM的失效率预计研究
2.Finite Element Simulation for 3-D Thermal Analysis of MCM;多芯片组件的三维温场有限元模拟与分析
3.MCM made by means of advanced thick film technology;基于先进厚膜技术的多芯片组件

英文短句/例句

1.Study on Thermal Placement Optimization of Stacked 3D-MCM Based on Thermal Superposition Model基于热叠加模型的叠层3D多芯片组件芯片热布局优化研究
2.Analysis of the Interconnect in Microwave Multi-chip Module by Parallel FDTD Technique;并行FDTD技术分析微波多芯片组件的互连效应
3.Warpage of Three-Dimensional Multi-Chip Module Based on Embedded Substrate基于埋置式基板的三维多芯片组件的翘曲研究
4.Performance of a silicon-based embedded MMCM package一种硅埋置型微波多芯片组件封装的电性能
5.Characteristics simulation of MEMS packaging using multichip modules technology基于微机械系统的多芯片组件封装和特性模拟(英文)
6.Design and transmission characteristics simulation in MCM placement and routing多芯片组件高速电路布局布线设计及信号传输特性仿真
7.Finite Element Simulation of Reliability and Life Prediction on Solder Joint of MCM;多芯片组件（MCM）焊点可靠性的有限元模拟与寿命的预测
8.Multi-chip Array Combination White Light LED Seal Research多芯片阵列组合白光LED封装研究
9.Development of Recognized Software on Multi-tumor Protein Chip Analysis System V1.0多肿瘤蛋白芯片肿瘤判别软件的研制
10.Design and Implementation of FPGA Hardware Emulation Platform and MIPS Chipset;FPGA硬件仿真平台和MIPS芯片组的设计与实现
11.Development of a Miniature T/R Front-end Using Microwave Multi-Chip Module Technology基于多芯片组装技术的小型微波收发前端研制
12.Construct cell immuno-chip with tissue microarray technique应用组织芯片技术构建细胞免疫芯片
13.Chipsets are key components in computers and other electronic devices that act as nervous systems channelling data between CPUs and other chips.芯片组是电脑和其它电子装置的关键部件，是CPU和其它芯片之间数据传输的中枢系统。
14.SOAC System On a Chip系统集成多功能芯片
15.A unit composed of an assemblage of pieces welded together.焊件由许多片焊接在一起的金属片组成的元件
16.In 1971, large scale integration (LSI) was used to put thousands of gates on a chip.1971年，在一块芯片上集成了上千个组件的大规模集成电路（lsi）问世。
17.Simulation Method in Single Chip Systems_5. An Example for Designing Component Simulation Softwaer芯片模拟仿真方法——5.组合模拟仿真软件设计实例
18.DNA Microarray-based Transcriptomics Study of Yersinia Pestis in Response to Various Conditions;基于DNA芯片技术鼠疫耶尔森氏菌在不同条件下的转录组学研究

相关短句/例句

multi-chip module多芯片组件
1.This paper uses a RLC transmission line model to represent the multi-chip module interconnect, and figures out the interconnect power consumption equation in frequency domain.使用RLC传输线模型对多芯片组件的互连进行表征,通过对输入互连的电流及其等效电阻的近似,推导得出多芯片组件互连功耗的频域数学表达式,并给出了计算机仿真实验结果。
2.Multi-Chip Module (MCM) technology attracts much more attention in researching and developing microelectronic packaging technology because of its special characteristics, such as small volume, high packaging density, high performance, high reliability and so on.多芯片组件技术(Multi-Chip Module, MCM)以其体积小、组装密度高,性能高、可靠性高等特点成为了当前微电子封装技术领域研究和发展的热点。
3.3D Multi-chip module (MCM) is one of the new directions.众所周知,随着大规模集成电路的发展,对芯片之间的互连提出了更高的要求,高端电子系统中高密度封装技术逐渐成为发展的主流,其中叠层型多芯片组件(MCM)就是其中的一种。
3)multichip module多芯片组件
1.Analysis of electromagnetic interference spectrum in multichip modules;多芯片组件电磁干扰频谱中的两次峰值问题研究
2.Characteristics simulation of MEMS packaging using multichip modules technology;基于微机械系统的多芯片组件封装和特性模拟(英文)
3.Based on the static field,the moment of method (MoM) is used to extract the equivalent circuit parameters of the interconnects in multichip module (MCM).在准静态场的基础上，采用矩量法（ＭｏＭ）对多芯片组件（ＭＣＭ）中互连线结构进行了分析。
4)multi-chip module(MCM)多芯片组件
1.At last, a multi-chip module(MCM)BIST scheme is briefly introduced by comparison.分析了数字VLSI电路的传统测试手段及其存在问题,通过对比的方法,讨论了内建自测试(BIST)技术及其优点,简介了多芯片组件(MCM)内建自测试的目标、设计和测试方案。
5)Multi-chip module多芯片组件(MCM)
6)microwave MCM微波多芯片组件
1.Micro-Interconnects in Microwave MCM;微波多芯片组件中的微连接
2.Microwave Characteristics of Bonding Interconnects in LTCC Microwave MCM;LTCC微波多芯片组件中键合互连的微波特性