1)tin[英][t?n][美][t?n]Sn
1.Measurements of release sound velocities of tin with reverse-impact method;反向碰撞法测量Sn的高压卸载声速
2.The oxidation behviours of liquid tin with and without trace Ge at 250℃in atmo- sphere were studied by both observation and removing dross from the surface periodically.采用观察液态Sn表面氧化行为和刮取表面氧化渣的方法,研究了微量元素Ge对液态Sn在大气和250℃条件下表面抗氧化性能的影响,并与纯Sn的氧化行为进行对比;利用X射线光电子能谱仪(XPS)、扫描电子显微镜(SEM)研究了合金表面元素的含量、价态,及合金氧化后的表面形貌。
3.Based on Atomic and Molecular Reaction Statics and Group theory, the basis sets SDD~(**) for Tin and 6-311g~(**) for H_2, and density functional (B3P86) method have been used to calculate energy E, heat capacity C_v, entropy S of hydrogen isotopes and their Tin compounds.根据原子分子反应静力学与群论,确定了H2、D2和T2的基电子状态为1∑+g(D∞v),SnH、SnD和SnT的基电子状态为2∑+(C∞v)。
英文短句/例句
1.The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;Sn-Ag和Sn-Zn系多组元无铅软钎料研究
2.Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper SubstrateSn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
3.Aging Characteristics of Pd-Ag-Sn-In-Zn AlloyPd-Ag-Sn-In-Zn合金时效特性
4.Effect of Sn on the Microstructure and Properties of Ti-Zr-Nb-Sn Alloy System;Sn元素对Ti-Zr-Nb-Sn合金系组织和性能的影响
5.Catalytic Synthesis of Diphenyl Carbonate by Transesterification Ove Supported Sn on TiO_2 and Inorganic Sn;TiO_2负载Sn及无机Sn催化酯交换合成碳酸二苯酯
6.Effects of Sn content on the anticorrosion property of Ni-Sn-P alloy platingSn含量对Ni-Sn-P合金镀层耐腐蚀性能的影响
7.Effect of Sn content on microstructure and phase structure of TiNbSn alloySn含量对Ti-Nb-Sn合金组织及相结构的影响
8.CROSS SECTION CHANGING GROWTH PHENOMENON OF Sn WHISKER IN Sn-3.8Ag-0.7Cu-1.0Er LEAD-FREE SOLDERSn-3.8Ag-0.7Cu-1.0Er无铅钎料中Sn晶须变截面生长现象
9.The Reversibility of Liquid-liquid Structural Change of Pb-Sn、In-Sn and Pb-Bi Alloys;温度诱导Pb-Sn、In-Sn和Pb-Bi合金液—液结构转变的可逆性
10.Rapid Growth of Pb-Sb-Sn and Pb-Sn-Zn Ternary Eutectics under Substantial Undercooling Conditions;深过冷条件下Pb-Sb-Sn和Pb-Sn-Zn三元共晶的生长规律研究
11.The Effect of Melt Structure Transition on the Solidification of Binary Sn-Bi and Sn-Sb Alloys熔体结构转变对二元Sn-Bi和Sn-Sb合金凝固的影响
12.A Study on Hypoeutectic Sn-Zn Alloys as Lead-free Solders;亚共晶Sn-Zn合金无铅电子焊料研究
13.Aluminum Alloy Soldering Procedure Research Based on the Sn-Pb-Zn Solder;基于Sn-Pb-Zn钎料铝合金钎焊工艺研究
14.A Study of the Creep Property of Sn-9Zn Solder and Its Strengthen;Sn-9Zn钎料蠕变性能及其复合增强研究
15.Study on the Non-eutectic Sn-Bi Solders with Low Melting Point;Sn-Bi系低熔点非共晶无铅焊料的研究
16.A Study on Surface Bioactivity of NiTi and Ti-Nb-Sn Alloys;NiTi及Ti-Nb-Sn合金表面生物活性化研究
17.Research on Compressive Creep Bechavior of the Sn-Cu Lead-free Solder;Sn-Cu无铅钎料压蠕变性能的研究
18.Study on Compressive Creep Properties of the Sn-Zn Lead-free Solder;Sn-Zn无铅钎料压蠕变行为的研究
相关短句/例句
Sn(II) / Sn(IV)Sn(Ⅱ)/Sn(Ⅳ)
3)Sn whiskerSn须
1.Relations between the chemical composition of Sn finish and Sn whisker growth under temperature cycling;温度循环条件下电镀液配方对镀层Sn须生长的影响
2.Sn whisker growth in TC conditions had in a high rate,a high density and a uniform length.采用TO220封装的电子元件,研究了在温度循环条件下,元件Cu引脚上纯Sn镀层的Sn须生长行为。
4)Sn-plating镀Sn
5)sn-networksn-网
1.This paper proves that a weakly-sequential space X with a σ-weakly hereditarily closure-preserving sn-network has a σ-compact finite sn-network.文中证明了一个具有σ-弱遗传闭包保持sn-网的弱序列空间具有-σ紧有限sn-网。
6)S-N methodSN法
延伸阅读
(-)-2,3-O-Isopropylidene-sn-glycerol分子式：C6H12O3分子量：132.16CAS号：14347-78-5性质：密度1.062。沸点72-73°C (8 mmHg)。折射率1.433-1.435。闪点80°C。比旋光度-13.7° (neat)。水溶性miscible。
