1)lead frame引线框架
1.Study on heat treatment process of C194 copper alloy for lead frame;引线框架用铜合金C194热处理工艺研究
2.Development of Cu-Ni-Si alloy for lead frame;引线框架用Cu-Ni-Si合金的发展
3.Microstructure and properties of Cu-Ni-Si based alloys for lead frame;Cu-Ni-Si基引线框架合金的组织和性能
英文短句/例句
1.dual in line lead frame双列直插式引线框架
2.Specification of lead frames for plastic quad flat packageGB/T15876-1995塑料四面引线扁平封装引线框架规范
3.Specification of lead frames for plastic leaded chip carrier packagesGB/T16525-1996塑料有引线片式载体封装引线框架规范
4.Specification of lead frames for small outline packageGB/T15878-1995小外形封装引线框架规范
5.Specification of DIP lead frames produced by etchingGB/T15877-1995蚀刻型双列封装引线框架规范
6.Blanking die design and manufacturing process for 10-SIP lead wire frame10-SIP引线框架冲切模具设计及工艺
7.Quantitative Metallography Analysis of Cu-Cr-RE Leadframe Material;铜铬稀土引线框架材料的定量金相分析
8.Effect of Rare Earth on Oxidation Performance of Cu Alloys for Lead-frame;稀土对引线框架用铜合金氧化性能的影响
9.Fracture Analysis of Stainless Steel Belts for Tin Plating Chip Lead Frame芯片引线框架镀锡用不锈钢带断裂失效分析
10.Study on Preparation and Properties of C194 Alloy for Lead Frame引线框架用铜合金C194的制备与性能研究
11.The Design of Holding Feed Mechanism of the Die Bonder键合机引线框架夹持传送机构的设计与开发
12.Study on Internal Oxidation Kinetics of Cu-0.35Al-Ce Alloy Sheet Used for Lead Frame引线框架用Cu-0.35Al-Ce合金薄板内氧化动力学研究
13.Semiconductor integrated circuits--Specification for stamped lead frames of plastic DIPGB/T14112-1993半导体集成电路塑料双列封装冲制型引线框架规范
14.Research on High Strength and High Conductivity Copper Alloys for Lead Frame Used in Large Scale Integrated Circuit;大规模集成电路用高强度高导电引线框架铜合金研究
15.The Application of Surface Nanocone Array Technology in Lead-free Pd PPF Lead Frame;表面纳米针布阵技术在Pd PPF无铅引线框架中的应用
16.Research on the Processing Technics and Properties of the Rare-earth Element－Cu-Ni-Si Alloy as Lead-Frame Coil Strip;稀土-Cu-Ni-Si引线框架铜带的加工工艺与性能研究
17.A Disquisition On The Mothod Of Pre-plating Chemical Concentration Control引线框架电镀:预处理药品浓度对基材表面腐蚀的研讨
18.Research on the Processing Technics and Properties of the Rare-earth element-Cu-Ni-Si Alloy As Lead-Frame稀土-Cu-Ni-Si引线框架铜合金的加工工艺与性能研究
相关短句/例句
Leadframe引线框架
1.When the leadframe made of 4J42 alloy is brazed to the brazing zone of an alumina substrate using an AgCu28 filler in ceramic DIP production, the liquid filler often flows onto the surface of the leadframe after brazing, and the quality of finished products is influenced greatly.陶瓷DIP外壳需要使用AgCu28钎料将4J42合金引线框架与陶瓷基板的焊区钎焊在一起,焊后易出现钎料在引线框架上流淌的问题,影响产品的质量。
2.Inthispaper,themicrostructuresandtheirchangesinhightemperatureoftheinterfacesbetweenfourcivilcopperalloysforleadframeandSn -Pbsolderalloysarestudied .研究了四种国产引线框架用铜合金与Sn -Pb共晶焊料的界面结构及其在高温保温过程中的变化。
3.It was discussed the leadframe driving structure moving along line intermittently, especially the principle of the 3D cam in the designed die bonder.讨论了IC芯片粘片机的引线框架直线间歇式供送机构和空间凸轮的工作原理。
3)lead-frame引线框架
1.Effect of Rare Earth on Oxidation Performance of Cu Alloys for Lead-frame;稀土对引线框架用铜合金氧化性能的影响
2.The simulation results show that parameters such as material,shape and the thickness of the lead-frame have immediate effects on the thermal performance.介绍了AutoTherm软件热分析流程,通过仿真分析了集成电路封装中引线框架的形状、厚度、材料等参数对集成电路热性能的影响,提出了设计具有良好导热性能引线框架的条件,即尽量选用导热系数大的合金材料做引线框架。
4)support lead框架引线
5)lead frame materials引线框架材料
1.With the development of IC to high density?miniaturization?low cost, the count of I/O increased, lead pitch decreased, which demand high strength?high conductivity for lead frame materials.引线框架材料是半导体元器件和集成电路封装的主要材料之一，其主要功能为电路连接、散热、机械支撑等。
2.The Effect of lead frame materials on interface microstructure between copper alloys and SnPb solder was investigated by means of optical microscope and scanning electron microscope (SEM) equipped with energy dispersive X-ray spectroscopy.结果表明,引线框架材料对铜合金与SnPb共晶焊料界面组织有很大的影响,焊点在160℃高温老化300 h后,CuCrZr系合金和CuNiSi合金与SnPb的界面金属间化合物为Cu6Sn5,其厚度在5~10 mm; 而C194合金与SnPb的界面金属间化合物为分布有Pb颗粒的Cu6Sn5,厚度已高达60~70 mm,同时还发现有微小空洞存在,影响焊点的可靠性。
6)C194 alloy lead frameC194合金引线框架
延伸阅读
无针难引线1.比喻没有撮合者成不了事。
