Cu-Ag合金,Cu-Ag alloy
1)Cu-Ag alloyCu-Ag合金
1.Strain strengthening of Cu-Ag alloy in situ filamentary composites;Cu-Ag合金原位纤维复合材料的应变强化效应
2.Effects of annealing and cold-working on properties of continually-unidirectionally solidified Cu-Ag alloy;热处理和冷变形对连续定向凝固Cu-Ag合金性能的影响
3.The Cu-Ag alloy in situ filamentary composites with different Ag contents were prepared.制备了具有不同Ag含量的Cu-Ag合金及其原位纤维复合材料,增加Ag含量可以细化铸态组织和Ag纤维尺寸,增大合金的极限拉伸强度和电阻率。
英文短句/例句

1.Strain-stress Behavior and Microstructure of Cu-Ag Filamentary Microcomposites;纤维复合Cu-Ag合金组织与应力—应变行为
2.Microstructure and Electrical Conductivity of Cu-Ag Filamentary Microcomposites;纤维复合Cu-Ag合金组织与导电性能的关系
3.Evolution and Effect of Crystallographic Texture in Cu-Ag Filamentary Microcomposites;纤维相强化Cu-Ag合金的织构分布及作用
4.Active Brazing AlN Ceramic and Mo-Cu Alloy Using Ag-Cu-TiAg-Cu-Ti活性法封接AlN陶瓷与Mo-Cu合金
5.Rapid Solidification of Ag-Cu-Sb Ternary Eutectic Alloy;Ag-Cu-Sb三元共晶合金的快速凝固研究
6.Study on Cu-Ag-Si-Ga Series Brazing Filler Alloys with Low Vapour PressureCu-Ag-Si-Ga系低蒸气压钎料合金研究
7.A Study on the Active Brazing of AlN to W-Cu Alloy with Ag-Ti_4 Active Filler AlloyAg-Ti_4活性钎料钎焊AlN与W-Cu合金研究
8.Effects of Ag on Microstructure and Properties of Al-Cu-Mg AlloyAg对Al-Cu-Mg合金组织与性能的影响
9.Effects of Trace Ce on the Properties of Cu-Ag-Cr Alloy微量Ce对Cu-Ag-Cr合金性能的影响
10.Prestretching and Heat Treatment Process of Al-Cu-Mg-Ag AlloyAl-Cu-Mg-Ag合金形变热处理工艺研究
11.Brazing of C_f/SiC composite to Ti alloy using Ag-Cu-Ti-TiC composite filler materialsC_f/SiC复合材料与Ti合金的Ag-Cu-Ti-TiC复合钎焊
12.Microstructure Evolution and Strengthening Mechanism in Cu-6%Ag Filamentary Composites双相纤维复合Cu-6%Ag合金组织演化及强化机制
13.Electron Microscopy Study of Crystallization in Melt-Spun Zr-Al-Ni-Cu-Ag Amorphous Alloys;Zr-Al-Ni-Cu-Ag非晶合金晶化的电子显微研究
14.Rapid Crystal Growth of Ag-Cu-Ge Ternary Eutectic Alloy;三元Ag-Cu-Ge共晶合金的快速晶体生长研究
15.Electron Microscopy Investigation of Precipitates in Al-Cu-Mg-Ag(-Ce) Alloys;Al-Cu-Mg-Ag(-Ce)合金析出相的电子显微研究
16.Study on Production of Free-Lead Solder Alloy and Solder Alloy Fine Powder of Sn-Ag-Cu System;Sn-Ag-Cu系无铅焊锡合金及其微粉制备技术研究
17.Study on Cu/Ag Alloy Film Used for CdZnTe Detector Electrode;Cu/Ag合金薄膜用作CdZnTe探测器电极的研究
18.Research on Properties of Sn-Ag-Cu Solder Alloy Doped with Sb;掺杂Sb的Sn-Ag-Cu系焊料合金性能的研究
相关短句/例句

Cu-Ag,Cu-Zr and Cu-Ag-Zr alloyCu-Ag、Cu-Zr和Cu-Ag-Zr合金
3)Ag-Cu-Zn alloyAg-Cu-Zn合金
1.Adding Cr/Ti metal powder to improve brazing performance of Ag-Cu-Zn alloy to diamond;Cr、Ti金属粉改善Ag-Cu-Zn合金对金刚石的钎焊性能研究
2.Cr powder was added between Ag-Cu-Zn alloy and diamond grits to braze diamond on the steel substrate by means of high frequency induction heater.在Ag-Cu-Zn合金钎料中添加Cr粉,将混合钎料用于钢基体上的金刚石高频感应钎焊。
3.By appropriate process parameters,the Ag-Cu-Zn alloy ingot with good surface quality and even unidirectional microstructure was fabricated on the self-designed horizontal heated mould continuous casting apparatus.在自制的水平式热型连铸设备上,选用合适的工艺参数制备出了表面质量良好、内部组织沿轴向均匀分布的Ag-Cu-Zn合金铸棒。
4)Sn-Ag-Cu alloySn-Ag-Cu合金
1.Studies on electrodeposition behavior of Sn-Ag-Cu alloy;Sn-Ag-Cu合金电沉积行为的研究
2.The electroplating process for Sn-Ag-Cu alloy coatings in weak acid bath is optimized.对弱酸性甲磺酸盐-碘化物电镀Sn-Ag-Cu合金工艺进行了优化,镀层光亮、致密、平整,阴极电流效率提高到25%左右。
3.The effect of the concentrations of main salts and the process conditions on the compositions,and the morphologies of Sn-Ag-Cu alloy electrodeposits were investigated by X-ray fluorescence(XRF) and scanning electron microscopy(SEM).研究表明,Sn-Ag-Cu合金的电沉积是正则共沉积。
5)Cu-Ag-Zr alloyCu-Ag-Zr合金
1.Influence of thermo-mechanical processing on microstructure and mechanical properties of Cu-Ag-Cr and Cu-Ag-Zr alloys;形变热处理对Cu-Ag-Cr和Cu-Ag-Zr合金组织和性能的影响
2.Influence of heat treatment on the properties of Cu-Ag and Cu-Ag-Zr alloys;热处理工艺对Cu-Ag和Cu-Ag-Zr合金性能的影响
3.Cu-Ag-Zr alloys are produced by means of a vacuum induction furnace.采用真空熔炼的方法制备了Cu-Ag-Zr合金,研究了微量Zr对Cu-Ag合金磨损行为的影响,探讨了合金的磨损机理。
6)Cu-Ag-Cr alloyCu-Ag-Cr合金
1.Discuss on aging characteristics and electrical sliding wear resistance of trace alloyed Cu-Ag-Cr alloy contact wire;接触线用微合金化Cu-Ag-Cr合金时效析出行为和电磨损机理探讨
2.Study on the electrotribological property of Cu-Ag-Cr alloy;Cu-Ag-Cr合金电摩擦性能研究(英文)
3.The results showed that Cu-Ag-Cr alloy had an excellent combination of microhardness and electrical conductivity.结果表明:Cu-Ag-Cr合金在440℃时效4h达到电导率和显微硬度的良好结合;微量AR的加入,使得Cu-Cr合金在440℃时效时的峰值硬度约增加6HV,且明显抑制 Cu-Cr合金的过时效。
延伸阅读

A1-Cu-Co合金中十次对称准晶单晶体及其衍射图A1-Cu-Co合金中十次对称准晶单晶体及其衍射图  ‘ Al Cu—Co合金中十次对称准晶堕晶体e1)及其衍射圈(z) 中国科学盹垒禹研览听供稿