1)solder paste焊膏
1.The quality of solder paste printing is one of the key factors.SMT生产工艺决定了电子产品的可靠性,焊膏印刷质量的好坏是其关键因素之一。
2.At the same time, deficiencies in the solder paste-tin ball testing were avoided that only the final pattern of the process could be available and its middle process could not be observed.通过体视显微镜和CCD等视频设备录制、焊膏回流动态测试方法,观察焊膏回流的整个过程,有助于分析焊膏回流过程中出现的问题,弥补了目前焊膏–锡珠试验只能观察最终结果,而不能对中间过程进行评价的缺点。
3.Solder paste is essential material in SMT, which is widely used in reflow soldering.焊膏是SMT工艺中不可缺少的钎焊材料,广泛应用于再流焊中;它是由一定的合金粉末和助焊剂均匀混合而成的膏状体。
英文短句/例句
1.A Study of Interconnection Reliability for Low-temperature Sintered Nano-silver Paste;纳米银焊膏低温烧结粘接可靠性研究
2.Selection of Solder Paste in Electronic Assembly电子组装中无铅焊膏的选择(续完)
3.Study of active substance for SnAgCu lead-free solder pasteSnAgCu无铅焊膏用活性物质研究
4.MThoe mProecnestsu Cmon-ttryolp oef PrinterMomentum型印刷机的焊膏印刷工艺控制
5.Application of SPC in Quality Control of Solder Paste PrintingSPC在焊膏印刷质量控制中的应用
6.Effects of Rosin Resin on Properties of SnAgCu Solder Paste松香树脂对SnAgCu焊膏性能的影响
7.Viscosity-A Key Factor for Quality Control in Solder Paste Printing黏度——决定焊膏印刷质量的关键因素
8.Solvent may be easily vaporized when solder paste is contacted with air-conditioned current or wind and hence reducing its tackiness.不要将焊膏放近于风口的位置，因为这样会使焊膏中的溶剂蒸发，降低其粘性。
9.The Synthesis of the New Activator and Applied in the Lead-free Solder Paste新型活化剂的合成及在无铅焊膏产品上的应用
10.Development of Brazing Grease for Stainless Steel-Aluminum in High Frequency Induction Brazing;不锈钢—铝高频感应钎焊膏状钎料的研制
11.The Study Based on Characteristics of Stencil Opening Hole in the Solder Paste Deposition Process;基于模板特性影响焊膏印刷落锡量过程控制研究
12.All solder powders that are used for our paste manufacturing are made under inert atmosphere and under tight quality control program.我们制造焊膏所使用的焊锡粉是在惰性气体和严格质量控制之下制成的。
13.The Investigation of Analysis Method for Import Flux;1 进口焊膏中助焊剂的剖析方法研究 2 卡尔费休库仑法测定SF_6中痕量水
14.To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
15.The Pilot Preparation and Study on New Type Flux and Solder Paste;新型助焊剂与焊锡膏的制备与研究初探
16.Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
17.Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
18.It will cause the paste oxidation and lose flux ratio balance if it is exposed for long-time.锡膏与空气长时间接触后，会造成锡膏氧化、助焊剂比例成分失调。
相关短句/例句
solder-paste焊膏
1.The article introduces many factors of infecting quality in Solder-paste printing process and have analyzed those reasons, presents some corrective actions and advice at the same time, and moreover, this paper simply introduces the theory and the application of solder-paste height inspection, indicates that 3D AOI inspection is necessary method to guarantee the quality of electronics assembly.焊膏印刷是SMT生产中关键工序之一,其控制直接影响着组装板的质量。
2.Solder-paste printing plays an important part in SMT production, and affects the quality of assemblies.焊膏印刷是SMT生产中关键工序之一 ,其控制直接影响着组装板的质量。
3.Solder-paste printing plays an important part in SMT production, and affects the jointing quality of.焊膏印刷是 SMT 生产中的关键工序,影响 PCB 组装板的焊接质量。
3)soldering paste焊膏
4)solder paste焊膏;锡膏
5)soldering paste焊锡膏;焊油
6)middle temperature solder paste中温焊膏
延伸阅读
焊膏印刷工艺选择焊膏：应使用第3类(锡球尺寸为25至45微米)或第四类(20至38微米)的锡膏，选择哪一类取决于模板开孔的尺寸。建议使用低卤化物含量(<100 PPM)和免清洗的、J-STD-00指定的ROL0/REL0树脂助焊剂，可以省去回流装配后的清洗工作。 制作模板：使用激光切割不锈钢箔片加电抛光技术或镍金属电铸成形的制作工艺。镍电铸成形工艺虽然比较昂贵，但是对于从超小的开孔进行焊膏沉积的过程最具可重复性。这种方法还有一个优点，可以形成任何用户所需要的厚度。具有梯形截面的模板开口有助于焊膏的释放。 焊锡模板开口设计：对于激光切割SS使用纵横比为0.75的孔径；对于镍金属电铸成形，使用纵横比为0.66的孔径，方圆形(25微米角径)开口有助于焊膏沉积的重复性。孔径纵横比定义为孔径开口面积除以孔径边缘的面积。也可以使用偏离基板焊盘的X、Y坐标轴，使每个焊点的粘贴沉积度最强，焊点之间的影响最小。 焊锡模板的厚度：焊锡模板的厚度应该不超过焊点的高度，必须达到实际孔径设计所对应的纵横比的要求。在采用混合技术的PCB装配中，如果这些模板要求与其他SMT元件的要求相冲突，可以使用符合IPC-7525设计标准的低一级的模板工艺或双印刷模板工艺。
