1)plating rate镀速
1.Effects of compound chemical plating Ni-P-graphite on plating rate;复合化学镀Ni-P-石墨工艺对镀速的影响
2.The influences ofρ(Cr3+),ρ(additive),ρ(H 3 BO3),φ(complexant)and pH value on bath's covering power and plating rate,of plating time on plating rate and deposit thickness were studied respectively.分别探讨了ρ(Cr3+)、ρ(添加剂)、ρ(H3BO3)、φ(络合剂)和pH对镀液覆盖能力和镀速,电镀时间对镀速和镀层厚度的影响。
3.SEM photos obtained with the three processes were analyzed,and the effects of several additives such as thiourea,potash iodate,potassium nitrate and lead ion on bath stability and plating rate were studied.采用了两种不同的酸蚀-活化工艺以及一种碱性预镀镍工艺作为铝合金化学镀镍的前处理工艺,分析了获得的SEM照片,比较了常用稳定剂硫脲、KIO3、KNO3、Pb2+对镀液稳定性及镀速的影响。
英文短句/例句
1.The Plating Ration and Life-Span Study of Acidic System and High Phosphorus Solution of Electroless Plating;酸性体系高磷镀层化学镀液镀速与寿命的研究
2.Talking about Chinese galvanized sheet development from quick increase of its production capacity in the world;从世界镀锌板能力迅速增加看我国镀锌板发展
3.The Effects of Rapid Thermal Annealing on the Crystalline Phases of Zinc-Magnesium Alloy Film Prepared by Vacuum Evaporation快速退火对真空镀锌镁合金镀层晶相的影响
4.Factors Affecting the Deposition Rate of Poised Electro-Brush Plated Nickel Coating脉冲电刷镀镍中沉积速度的影响因素
5.High-speed Determine of Gold in Gold-plated Solution and Exhausted Wash Liquid镀金溶液与漂洗废液中金的快速测定
6.Rapid Determination of Micro Cobalt in New Bright Sn-Pb-Co Alloy Plating Bath新型光亮镀锡铅钴合金镀液中微量钴的快速测定
7.at is concluded that by this process bright Zn plating can be provided with high deposition rate, low cost and reliable quality.结论是本工艺可镀出全光亮的锌镀层、沉积速度快、成本低,质量稳定。
8.Comparative Analysis of Zinc Coat and Zn-Al Alloy Coat in Highway Fence高速公路隔离栅热浸镀锌和锌铝合金镀层的对比分析
9.Effect of Plating Parameters on Plating Rate and Thickness as well as Surface Morphology of Electroless Tin Coating化学镀锡工艺参数对沉积速率、镀层厚度及表面形貌的影响
10.Nano PTFE in Ni composite coatings by high speed jet electrodeposition纳米PTFE粒子细化高速电喷镀镍基复合镀层的组织
11.It was proved thet the pooperties of the bath is stable,the deplsition rate is considerably high,the edposited layer possess fairly high hardness and good adhesive power to the substrate.试验结果表明:镀液性能稳定,镀层沉积速度快,镀层硬度高、质量好、结合强度大。
12.Effects of composition in solution and process conditions on deposition rate were studied.研究了镀液组成及操作条件对沉积速率的影响。
13.Research of Accelerated Corrosion Test of Zinc,CadmiumCoating on High-strength Steel高强度钢表面镀锌、镉层加速腐蚀试验研究
14.A Research on the New Technique for Rapid Stripping of Cu/Ni/Cr Deposits快速退除铜/镍/铬等金属镀层新工艺的研究报告
15.Report on the First Phase of the Experiment in the Rapid Graphitizing of Malleable Cast Iron By"Hot Soaking-Plating in the Liquid of Metal"可锻铸铁热浸镀快速石墨化试验第一阶段报告
16.High Speed Acidic Electroplating Technology of Compact and Bright Sn and Sn-Cu Alloy for Copper Wire铜线材酸性高速电镀致密光亮锡、锡铜合金
17.Research on High-Speed Drilling and Marking Laser Instrument for ETL Line of Cold Rolling;冷轧镀锡生产线高速激光孔标仪的研制
18.A Study on the Methodology of Rapid Manufacturing Metal Die by Metal Plating;金属喷镀法快速制作金属模具方法研究
相关短句/例句
deposition rate镀速
1.Studies on deposition rate of electroless nickel-phosphorus alloy plating;化学镀镍磷合金镀速的研究
2.The effects of various compound stabilizers on the stability and deposition rate of the plating bath,and the porosity,corrosion resistance,and adhesion of the electroless Ni-P alloy coatings were investigated,which was aiming at development of the combined stabilizers suitable to the electroless Ni-P plating.06个/cm2,耐浓硝酸时间为171 s,镀速为18。
3.The effects of nickel salt concentration,tin salt concentration,reductant concentration,complexing agent concentration,temperature and pH on the deposition rate and deposit quality of electroless Ni-Sn-P alloy plating were discussed.介绍了近年来国内外在化学镀Ni-Sn-P合金镀层方面的研究进展,探讨了镍盐含量、锡盐含量、还原剂含量、络合剂含量、温度和pH等因素对化学镀Ni-Sn-P合金的镀速及镀层质量的影响。
3)Plating speed镀速
1.Among a few low temperature formlae, a technical formula of good performance in plating speed,corrosion-resistance, etc, was selected; and an oplimum complexing compound was found.通过对比低温环境下几个配方工艺,提出了一个在镀速、耐蚀性等方面均表现较好的工艺配方,同时发现了一种有优越作用的复合配合剂。
2.The results show that a suitable amount of RE makes plating speed higher and plating bath stable;RE can deposit with Ni,P particles,play a role of micro-alloying and form the electroless coating with RE.结果表明,镀液中加入适量的稀土氧化物能提高镀速、稳定镀液;稀土能与Ni、P粒子共沉积,起微合金化作用,形成含RE的化学镀层。
4)electrodeposition rate testing镀速检测
5)high speed electroplating高速电镀
1.To search for a high speed electroplating Sn and Sn alloy technology with low cost, low corrosive and low pollution, the Sn and Sn\|Cu alloy coatings were deposited on copper wire of 0.为了寻找低成本、低腐蚀、低污染高速电镀锡、锡铜合金工艺 ,在含光亮剂、柔软剂DL0 1、0 2、0 3的硫酸槽中在不同的电流密度、不同的搅拌速度下 ,在Φ0 。
6)fast zinc-electroplating快速镀锌
延伸阅读
笃速速1.亦作"笃簌簌"。 2.战抖貌。
