1)solder joint shape焊点形态
1.Using the mode and simulatrng the solder joint shapes,find the root cause of solder defects identify the relationship of designand process parameters,suggest design improvemet.结合仿真技术模拟焊点形态,可以找出造成焊点缺陷时各参数之间的关系并提出相应的解决方案,从而优化工艺设计及制造工艺控制参数。
2.3-D(Three-dimensional) predicting model of QFN solder joint shape is built by Surface Evolver software based on minimal energy principle and finite mathematical analysis method.采用基于最小能量原理和有限元数值分析方法的Surface Evolver软件,建立了四方扁平无引脚器件(QFN)焊点三维形态预测模型;选取焊盘长度、焊盘宽度、焊料体积、间隙高度作为4个关键因素,采用水平正交表设计了9种不同的QFN焊点工艺参数水平组合,建立了这9种焊点的三维形态预测模型,得到了不同工艺参数水平组合下的QFN焊点形态;焊盘长度、焊盘宽度、焊料体积、间隙高度等工艺参数的改变对QFN焊点的三维形态均有影响。
3.The 3-D evolving model of LCCC solder joint shape is based on the minimal energy principle and the solder joint shape theory.基于最小能量原理和焊点形态理论,建立了LCCC器件焊点三维形态预测模型。
英文短句/例句
1.Prediction of Laser Spot Weld Shape by Using Artificial Neural Network基于人工神经网络的激光点焊焊点形态预测
2.Impact of Stencil for Flip-Chip Shape and Their Reliability Study模板对倒装焊焊点形态的影响及其可靠性研究
3.The Establishment and Solution of a Shape Model of Soldered Joints of Surface Mount表面组装焊点形态模型的建立及求解
4.Solder Joint Shape Prediction of Microelectronics Assembly Surface Mount Component微电子组装表贴元件焊点三维形态预测
5.A Improvement Method On Segmentation And Extraction of BGA Joint by Mathematical Morphology基于数学形态学BGA焊点分割和提取的改进方法
6.The joint formed by welding.焊接点通过焊接形成的接合点
7.The Numerical Simulation of Welding Deformation of Spot Welding Joint不锈钢点焊接头焊接变形数值模拟分析
8.Research on Condition Monitoring of Spot Welding Equipment Based on LabVIEW基于LabVIEW的点焊设备状态监测系统研究
9.Research on Reliability of SMT Solder Joint in Dynamic Tensile Load动态拉伸载荷下SMT焊点可靠性研究
10.Research on MIG welding arc with additional longitudinal alternating magnetic field外加纵向磁场作用下的MIG焊电弧形态
11.Study on the Numerical Simulation for Resistance Spot Welding with Rectangular Tip Electrode;矩形端面电极电阻点焊数值模拟研究
12.Numerical Simulation on the Process of Multi-point Forming for Tailor-Welded Blank;拼焊板多点成形过程的数值模拟研究
13.Theoretical Study on Stamping Formability of Spot Welding Tailored Blanks;点焊拼接板冲压成形性能的理论分析
14.Research on Strength of Welds in Overlaped RHS K(N)-joints;矩形管K（N）型搭接节点焊缝计算研究
15.Study on SMT Solder Joints Quality Inspection and Intelligent Discrimination Based on Solder Joint Virtual Evolving Technology;基于焊点虚拟成形技术的SMT焊点质量检测和智能鉴别技术研究
16.Forming For Resistance Spot Welding of Non-thick Dissimilar Steel and Neural Network Prediction非等厚异种钢电阻点焊焊点成形及神经网络预测
17.Numerical simulation of transient three-dimensional shape of TIG weld pools based on FLUENT基于FLUENT的TIG焊瞬态熔池三维形态的数值模拟
18.Analysis of the molten pool image of MAG welding based on fractal and mathematical morphology基于分形和数学形态学的MAG焊熔池图像分析
相关短句/例句
solder joint shapes焊点形态
1.By applying the relation between the solder joints shape parameters and thermal fatigue life,and based on the solder joint reliability,the optimization software is used in the optimal evaluating of the solder joint shapes.通过对 CCGA焊点形态参数与热疲劳寿命进行正交回归分析 ,得出了 CCGA焊点形态主要参数与热疲劳寿命之间的关系表达式。
2.In this paper, based on presenting the basic concept of solder joint shapes theory and virtual evolving technology of SMT solder joint, the application theory and methods of SMT solder joint virtual evolving technology in the field of SMC/SMD component structure design , SMT product assembling process design and assembling quality detecting are demonstrated.在介绍 SMT焊点形态理论和焊点虚拟成形技术基本概念的基础上 ,论述了该技术在 SMT元器件结构设计、SMT产品组装工艺设计和组装质量检测等领域中的应用原理及方法。
3)solder joint geometry焊点形态
1.By employing the potential energy controlling equation for SnPb solder joint formation in surface mount technology,the 3D solder joint geometry were numerically simulated.采用表面组装SnPb焊点形态的势能控制方程 ,对片式元件RC32 16的三维焊点形态进行了数值模拟。
2.Energy controlling equation for solder joint geometry in flip chip technology was presented and three dimensiond duplex solder joints (with high Pb base solder bump and eutectic SnPb solder fillet) geometry was predicted by using surface evolver program.本文给出了倒装焊 (flip chip)焊点形态的能量控制方程 ,采用SurfaceEvolver软件模拟了倒装焊复合SnPb焊点 (高Pb焊料凸点 ,共晶SnPb焊料焊点 )的三维形态 。
4)3-D shape of solder joint三维焊点形态
5)theory of solder joint shape焊点形态理论
1.According to the characteristics that SMT solder joint quality is related to its 3-D geometrical shape directly, theory of solder joint shape was put forward.根据SMT焊点质量与焊点的三维几何形态直接相关的特点 ,提出了SMT焊点形态理论。
6)Solder joint shape prediction焊点形态预测
延伸阅读
激光焊与氩弧焊的修模具的区别激光焊与握弧焊是常用的模具修复的两种方法。氩弧焊氩弧焊是电弧焊的一种，利用连续送进的焊丝与工件之间燃烧的电弧作热源，由焊炬喷嘴喷出的气体保护电弧来进行焊接的。目前氩弧焊是常用的方法，可适用于大部分主要金属，包括碳钢、合金钢。熔化极惰性气体保护焊适用于不锈钢、铝、镁、铜、钛、锆及镍合金，由于价格低，被广泛用于模具修复焊，但焊接热影响面积大、焊点大等缺点，目前在精密模具修补方面已逐步补激光焊所代替。激光焊激光焊是高能束焊的一种，激光焊是利用大功率相干单色光子流聚焦而成的激光束为热源进行的焊接。这种焊接方法通常有连续功率激光焊和脉冲功率激光焊。激光焊优点是不需要在真空中进行，缺点则是穿透力不如电子束焊强。激光焊时能进行精确的能量控制，因而可以实现精密器件的焊接。它能应用于很多金属，特别是能解决一些难焊金属及异种金属的焊接。目前已广范用于模具的修复。修复模具时的主要区别使用非消耗电极与保护气体，常用来焊接薄工件，但焊接速度较慢，且热输入比激光焊大很多，易产生变形，激光焊焊缝的特点是热影响区范围小，焊缝较窄,焊缝冷却速快、，焊缝金属性能变化小，焊缝较硬。精密模具的焊接不同于其他零件焊接，其对质量控制的要求非常严格，而且工件的修复周期必须越短越好。传统的氩焊发热影响区大，对焊接周边造成下塌，变形等几率非常高，对于精度要求高，焊接面积大的模具，必须经过加温预热，在特定温度下进行焊接，还要自然降温进行退火处理，如此折腾下来费用和时间都不能为用户所接受；而冷焊又存在焊接不牢固和脱落等缺陷。而激光焊没有氩焊和冷焊这些不足，因此逐渐被广泛应用。
