1)lead-free solder joint无铅焊点
1.Reliability of lead-free solder joint for FCOB in hygrothermal environment;湿热环境下倒装焊无铅焊点的可靠性
2.Effect of Sb doped SnAgCu lead-free solder joint on electromigration reliability;Sb掺杂对SnAgCu无铅焊点电迁移可靠性的影响
3.Failure analysis of lead-free solder joints based on resistance strain critical point基于电阻应变临界点的无铅焊点失效分析
英文短句/例句
1.Finite element analysis on reliability of lead-free soldered joints for CSP deviceCSP器件无铅焊点可靠性的有限元分析
2.Thermal reliability optimization study on PBGA lead-free solder jointPBGA无铅焊点热可靠性优化研究
3.Failure analysis of lead-free solder joints based on resistance strain critical point基于电阻应变临界点的无铅焊点失效分析
4.Fatigue-Life Predicyion for Lead-Free Solder Joints and Study for Effect of IMC on Reliability of Solder Joints;无铅焊点寿命预测及IMC对可靠性影响的研究
5.Board Level Lead-Free Solder Joints Reliability Analysis under Drop Shock Loading;板级无铅焊点跌落冲击载荷下可靠性分析
6.Peel Stress Analysis of Lead-free Solder Ball Based on Numerical Simulation;基于数值模拟的无铅焊点剥离应力分析
7.Finite Element Simulation and Life Prediction for Reliability of Lead-free Solder in PBGA;PBGA无铅焊点可靠性的有限元模拟与寿命预测
8.Interfacial Evolution and Reliability of Lead-Free Solder Joints for Electronic Packaging;电子封装中无铅焊点的界面演化和可靠性研究
9.Research on the Theory & Experiments of SMT Lead-Free Solder Joint Reliability under Drop Impact;跌落碰撞下SMT无铅焊点可靠性理论与实验研究
10.Mechanism and Reliability of Lead Free Joints Fabricated by Low Temperature Ultrasonic Bonding无铅焊点低温超声互连的机理及可靠性研究
11.Study of Intermatallic Compounds and Kirkendall Voids in Solder Joints of Lead-free Solder无铅焊点界面化合物及Kirkendall空洞实验研究
12.The Morphology and Aging Evolution of IMC in low-Ag SnAgCu Soldering低银无铅焊点的界面化合物形貌与演变
13.Resistance strain and temperature hysteresis loops properties of lead free solder joint无铅焊点的电阻应变温度迟滞回线特性
14.Robust Positioning Algorithm of Lead-Free Solder Joints Based on Gray-Level Integration Projection无铅焊点鲁棒定位的灰度积分投影算法
15.Failure Analysis of BGA Lead-free Solder Joints under Drop Impact跌落碰撞下球栅阵列无铅焊点失效分析
16.Effect of Thermomechanical Fatigue on Properties of Lead-Free Solder Joint with Nano-Structured Reinforcements热疲劳对纳米结构强化的无铅焊点性能的影响
17.Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering jointsSn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
18.Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
相关短句/例句
lead-free solder joints无铅焊点
1.Development of creep resistance test system for lead-free solder joints;无铅焊点蠕变电阻测试系统的研制
2.An AOI algorithm for transistor lead-free solder joints of SMT post-reflowSMT炉后晶体管类元件无铅焊点的自动光学检测算法
3.Through appearance testing,X-Ray testing and temperature cycling testing,the reliability of mixed solder joints and lead-free solder joints which formed under various process parameters was assesed.通过对不同工艺参数下形成的混合焊点和无铅焊点进行了外观检测、X射线检测和温度循环测试。
3)lead-free BGA solder joint无铅BGA焊点
4)SMT lead-free solder jointSMT无铅焊点
5)Lead-free microscale solder joint无铅微焊点
6)Sn-Ag-Cu lead-free jointsSn-Ag-Cu无铅焊点
延伸阅读
激光焊与氩弧焊的修模具的区别激光焊与握弧焊是常用的模具修复的两种方法。氩弧焊氩弧焊是电弧焊的一种，利用连续送进的焊丝与工件之间燃烧的电弧作热源，由焊炬喷嘴喷出的气体保护电弧来进行焊接的。目前氩弧焊是常用的方法，可适用于大部分主要金属，包括碳钢、合金钢。熔化极惰性气体保护焊适用于不锈钢、铝、镁、铜、钛、锆及镍合金，由于价格低，被广泛用于模具修复焊，但焊接热影响面积大、焊点大等缺点，目前在精密模具修补方面已逐步补激光焊所代替。激光焊激光焊是高能束焊的一种，激光焊是利用大功率相干单色光子流聚焦而成的激光束为热源进行的焊接。这种焊接方法通常有连续功率激光焊和脉冲功率激光焊。激光焊优点是不需要在真空中进行，缺点则是穿透力不如电子束焊强。激光焊时能进行精确的能量控制，因而可以实现精密器件的焊接。它能应用于很多金属，特别是能解决一些难焊金属及异种金属的焊接。目前已广范用于模具的修复。修复模具时的主要区别使用非消耗电极与保护气体，常用来焊接薄工件，但焊接速度较慢，且热输入比激光焊大很多，易产生变形，激光焊焊缝的特点是热影响区范围小，焊缝较窄,焊缝冷却速快、，焊缝金属性能变化小，焊缝较硬。精密模具的焊接不同于其他零件焊接，其对质量控制的要求非常严格，而且工件的修复周期必须越短越好。传统的氩焊发热影响区大，对焊接周边造成下塌，变形等几率非常高，对于精度要求高，焊接面积大的模具，必须经过加温预热，在特定温度下进行焊接，还要自然降温进行退火处理，如此折腾下来费用和时间都不能为用户所接受；而冷焊又存在焊接不牢固和脱落等缺陷。而激光焊没有氩焊和冷焊这些不足，因此逐渐被广泛应用。
