热匹配,Thermo-match
Thermal-distributing热量匹配
3)thermal matching热匹配性
4)Water and heat matching水热匹配
5)thermal mismatching热不匹配
1.Residual stress exists in the PMMA microfludic chip due to the different thermal expansion coefficience,also called thermal mismatching of the mold and the polymer,which can result in the warpage and deformation of the chip.PMMA微流控基片在热压成形结束后由于模具和聚合物的热膨胀系数不同——热不匹配会产生残余应力,从而造成基片翘曲变形。
6)heat flow match热流匹配
延伸阅读

负温度系数热敏电阻陶瓷(见热敏陶瓷)负温度系数热敏电阻陶瓷(见热敏陶瓷)thermo-sensitive ceramics with negative temperature coefficient 负温度系数热敏电阻陶瓷thermo一sensitiveeeramies with negative temperature eoeffieient在某一特定温度范围，电阻率随温度的升高而明显减小的热敏陶瓷。简称NTC陶瓷。