1)cyanide-free gold-plated无氰镀金
1.Methods:The Ni ion poriness of both the sand blasting samples and the polishing samples after cyanide-free gold-plated treatment was determinated with dimethylglyoxime as indicator by pasting filter paper of nickel-chromium alloy.方法:将镍铬合金喷砂试件和镍铬合金抛光试件经过无氰镀金后,以二甲基乙二醛肟为指示剂采用贴滤纸法测定镍铬合金镀金层Ni离子的孔隙率。
英文短句/例句
1.Study on Additives in Gold electroplating for a Cyanide-free Bath一种新型无氰镀金配体及添加剂研究
2.Effect on the release of the Ni ion for the nickel-chromium alloy with non-cyanide gold-plated layer treatment无氰镀金对镍铬合金Ni离子析出的影响
3.Study on Plating 22K Au-Cu Alloy in Cyanide Free Bath;无氰电镀22K金—铜合金工艺研究
4.Study on Cyanide-free Eletroless Nickel Plating Process on AZ91D Magnesium AlloyAZ91D镁合金无氰浸锌化学镀镍的研究
5.Study on the Process of Cu-Sn-Zn Cyanide-free Gold Imitation PlatingCu-Sn-Zn三元无氰仿金电镀工艺研究
6.Microstructure and Properties of Cyanide-Fret Pulse-Plated Galvanizing Coating on AZ31B Magnesium AlloyAZ31B镁合金无氰脉冲镀锌层的结构与性能
7.Zinc base die castings are always copper plated in cyanide baths.锌基合金的压铸件总是在氰化镀液中镀铜。
8.Safeguard of Solution and influence of Impurities for Non- Cyaniding Silver Electroplating无氰镀银溶液的维护及杂质对镀层质量的影响
9.A low? cyanide bright gold plating process with pulse current was developed.开发出一种低氰脉冲光亮镀金工艺。
10.Cyanide-free copper electroplating in sulfite/thiosulfate bath亚硫酸盐/硫代硫酸盐体系无氰镀铜
11.cyanide inoganic of non-metals (excl. hydrogne cyanide)无机非金属氰 化物(不包括氰化氢)
12.Development of non-toxic gold electrolytes, such as those based on sulfite complexes rapidly increased in recent years.而亚硫酸系的非氰化物镀金溶液,是近年来最令人注目的镀金技术。
13.HOLD ALL CYANIDE ADDITIONS AND BEGIN LETTING THE LEVEL OF METAL AND CYANIDE DECREASE.保持所有氰化物添加,同时开始将镀液内金属及氰化物浓度减低。
14.Investigation on Cyanide-free Alkaline Copper Electroplating and Eletrochemical Behavior无氰碱性镀铜工艺及其电化学过程的研究
15.Advances in experimental study and production practice of cyanide-free copper plating--Part Ⅱ无氰镀铜的实验研究与生产应用进展(二)
16.Process for Cyanide-Free Copper Electroplating of Aluminum Alloy and Its Application on Automobile Wheels Made of Aluminum Alloy无氰高密度镀铜工艺及其在汽车轮毂中的应用
17.Advances in experimental study and production practice of cyanide-free copper plating-Part I无氰镀铜的实验研究与生产应用进展(一)
18.cyanide ,inorganic, of non-metals (excl. hydrogen cyanide)无机金属氨氰酸盐( 不包括复或络氰酸盐)
相关短句/例句
non-cyanide imitating gold electroplating无氰仿金电镀
1.Research status of non-cyanide imitating gold electroplating;无氰仿金电镀的研究现状
3)Non-cyanogen gold-plating technique无氰镀金技术
4)non-cyanide plating无氰电镀
1.This paper focused on the influence of non-cyanide plating solution stability,the electroplating parameters on th.本文主要对无氰电镀共沉积制备金锡合金凸点的方法进行了研究,内容包括镀液稳定性,电镀参数对镀层的影响以及Au70Sn30共晶凸点的制各方法等,通过研究发现:1。
2.The non-cyanide plating has been obtained successfully.无氰电镀已取得了巨大的成功,但在镀层结合强度方面还存在一些问题,"电位活化"概念给出了理论解释。
5)cyanide-free silver electroplating无氰镀银
1.A cyanide-free silver electroplating process with 5,5-dimethyl hydantoin as coordination agent is studied.研究了5,5-二甲基乙内酰脲为配位剂的无氰镀银工艺。
6)cyanide-free copper plating无氰镀铜
1.Advances in experimental study and production practice of cyanide-free copper plating—Part I无氰镀铜的实验研究与生产应用进展(一)
2.Research and application of cyanide-free copper plating has made a certain progress and obtained effective achievements,but it still exists problem of low adhesion as plating on iron and steel substrates.无氰镀铜的研究应用已取得一定的进展和成效,但在钢铁基体上镀铜仍存在结合力差的问题。
延伸阅读
1-邻氰苯乙烯基-4-对氰苯乙烯基苯分子式:C24H16N2分子量:332.40CAS号:13001-38-2性质:熔点181-186°C。水溶性insoluble。