1)indirect resin间接树脂
2)indirect composite inlays间接树脂嵌体
1.The samples of group C were repaired by indirect composite inlays.A组用光敏复合树脂直接充填修复髓室底穿孔;B组用直接树脂嵌体修复髓室底穿孔;C组用间接树脂嵌体修复髓室底穿孔,两嵌体组均使用AH-p lus糊剂作为黏结。
3)resin bond树脂粘接
1.Development of the resin bond to dental ceramics;牙科陶瓷树脂粘接研究进展
英文短句/例句
1.The effect of water uptake of resin adhesives on the bond properties齿科树脂粘接剂的吸水性对粘接性能的影响
2.Shear Bond Strength of Resin Brackets Bonded to Porcelain and Light-cured Composite Resin;树脂托槽与瓷、光固化复合树脂粘接抗剪切强度的实验研究
3.The Effect on Bond Strength of Different Composite Resin Luting Cements to Fiber-reinforced Composite Root Canal Post6种复合树脂粘接剂与纤维增强型复合树脂根管桩的粘接强度研究
4.The Research of Improving Adhesive Capability of Epoxy with Nanoparticle (SiO_2);纳米SiO_2微粒改善环氧树脂粘接剂性能的研究
5.Effects of Surface Pre-treatments on Bonding Durability of Resin to Ceramic预处理方式对瓷与树脂粘接强度的影响
6.High-temperature performance of boron carbide modified phenol-formaldehyde resin bond to silicon carbide ceramicB_4C改性酚醛树脂粘接SiC陶瓷的高温性能
7.Study on the Changing of the Enamel Adhesive Surface and Resin Adhesive Capability During the Orthodontic Treatment;正畸治疗过程中牙釉质粘接面形态和复合树脂粘接性能变化的研究
8.Comparison of the Shear Bond Strength of Light-cured and Chemically-cured Resin Adhesive光固化和化学固化树脂粘接剂剪切强度的对比研究
9.Study on the Adhesive Property of Bismaleimide Oopolyiner Resin Modified with Polymer Additives高分子添加物改善双马来酰亚胺共聚树脂粘接性的研究
10.A Study on the Bonding Properties of a Self-adhesive Resin Cement;自粘接型树脂水门汀粘接性能的研究
11.The Study on Epoxy Adhesive Used in the Heat Exchanger换热器粘接用环氧树脂胶粘剂的研究
12.Synthesis and Characterization of Vinyl Chloride Copolymer with Enhanced Adhesive Property高粘接性氯乙烯共聚树脂合成与表征
13.The method of curing in a magnetic field is also suitable for resin coating and adhesive.磁场中固化还适用于树脂涂层和粘接层。
14.Preparation and bonding performance of epoxy resin modified by polyurethane聚氨酯改性环氧树脂的制备及其粘接性能
15.Study on influencing factors of epoxy resin bond strength used in superhard grinding wheels超硬磨具用环氧树脂胶粘剂粘接强度影响因素的研究
16.Influences of polyurethane structure on bonding performance of epoxy resin adhesive modified by polyurethane聚氨酯结构对聚氨酯改性环氧树脂胶粘剂粘接性能的影响
17.Microtensile bond strength to dentin of direct and indirect resin composite restoration复合树脂直接与间接修复的粘接微拉伸强度测试研究
18.Two-year clinical evaluation of direct bonding mobile anterior teeth with 4-META/MMA-TBB resin树脂直接粘接法固定牙周松动前牙的二年效果观察
相关短句/例句
indirect composite inlays间接树脂嵌体
1.The samples of group C were repaired by indirect composite inlays.A组用光敏复合树脂直接充填修复髓室底穿孔;B组用直接树脂嵌体修复髓室底穿孔;C组用间接树脂嵌体修复髓室底穿孔,两嵌体组均使用AH-p lus糊剂作为黏结。
3)resin bond树脂粘接
1.Development of the resin bond to dental ceramics;牙科陶瓷树脂粘接研究进展
4)contact pressure resin接触树脂
5)horizontal loader树脂接合
6)Grafting resin接枝树脂
延伸阅读
硫酸粘菌素 ,粘菌素,硫酸多粘菌素E药物名称：多粘菌素E英文名：Polymyxin E 别名： 多粘菌素E;可立斯丁;可刹迈仙干糖浆;硫酸抗敌素;硫酸粘菌素 ,粘菌素,硫酸多粘菌素E外文名：Colistin ,Polymyxin E 性状： 常用其硫酸盐，为白色或微黄色粉末；无臭或几乎无臭。有引湿性。在水中易溶，在乙醇中微溶，在丙酮、氯仿或乙醚中几乎不溶。 药理作用： 抗菌谱和体内过程与多粘菌素B相同。口服不吸收，用于治疗大肠杆菌性肠炎和对其它药物耐药的菌痢。外用于烧伤和外伤引起的绿脓杆菌局部感染和耳、眼等部位敏感菌感染。注射已少用。 适应症： 用于治疗大肠杆菌性肠炎和对其他药物耐药的菌痢。外用于烧伤和外伤引起的绿脓杆菌局部感染和耳、眼等部位敏感菌感染。注射已少用。 用量用法： 1.口服：成人１次５０万～１００万单位，１日３～４次。儿童１次量２５万～５０万单位，１日３～４次。重症时上述剂量可加倍。 2.外用：溶液剂每毫升含１万～５万单位，氯化钠注射液溶解。 注意事项： 1.可发生皮疹、瘙痒等过敏症状。胃肠道有恶心、呕吐、食欲不振、腹泻等不良反应。 2.孕妇慎用。 3.口服宜空腹给药。 规格： 片剂：每片50万;100万;300万单位。灭菌粉剂：每瓶１００万单位，供制备溶液用（１ｍｇ＝６５００单位） 类别：抗生素
