1)integrated power electronic module电力电子集成模块
1.Heat Transfer in Integrated Power Electronic Modules and in New Type of Plate-pin Fin Heat Sink;电力电子集成模块及新型翅柱复合型散热器的传热性能研究
2.This paper presents a novel pressure contact interconnect technique in integrated power electronic module(IPEM) with high reliability.提出了一种在电力电子集成模块内使用的簧片压接互连工艺,该工艺具有很高的长期可靠性,核心是使用铍青铜制作的弹簧,该弹簧不仅提供足够的压接力,同时还实现可靠的电气连接。
3.The mutual inductance coupling between power circuit and control/drive circuit is main EMI approach inside a hybrid Integrated Power Electronic Module (IPEM) with low voltage and high current.低压大电流混合封装电力电子集成模块(IPEM)内部功率电路与控制和驱动电路之间的互感耦合是电磁干扰的主要途径之一,为了准确预测电磁干扰的强度,需要对耦合互感进行精确计算,文中针对这个问题展开研究。
英文短句/例句
1.Research on EMI Shielding Inside Hybrid Intergrated Power Electronic Module混合封装电力电子集成模块内电磁干扰的屏蔽
2.Thermal Characteristic of a Novel Flat Plate Heat Pipe for Hybrid Integrated Power Electronic Module电力电子集成模块用平板热管的传热研究
3.Heat Transfer in Integrated Power Electronic Modules and in New Type of Plate-pin Fin Heat Sink;电力电子集成模块及新型翅柱复合型散热器的传热性能研究
4.Thermal Design of Integrated Power Electronics Module Using Flip-Chip Technology倒装芯片集成电力电子模块的热设计
5.Modeling of parasitic parameters for integrated power electronics module using flip chip technology倒装芯片集成电力电子模块寄生参数的建模
6.Research on Key Aspects in Integrated Power Electronics Modules for High Power Applications;大功率集成化电力电子模块关键技术研究
7.Integrated power electronics module based on chip scale packaged power devices基于芯片尺寸封装功率器件的集成电力电子模块(英文)
8.IC's have become the basic "modules from which digital circuits are constructed.集成电路就成了数字电路的组成模块。
9.thermionic integrated micromodule circuit热电子集成式微模电路
10.Design of ARMA Module Based on BIST Technology of Analog Integrated Circuit基于模拟集成电路BIST的ARMA模块设计
11.Heating Mechanism and Abstraction Measures of the Power Electron Module电力电子模块的发热机理与散热措施
12.Integrated Circuits Design and Verification for FTTH Transmitter and Receiver Module;FTTH光模块集成电路设计与验证
13.The Research on the Planar Integrated Magnetics in Voltage Regulator Module;电压调整模块中平面集成磁件的研究
14.The Integrated Modular Avonics Eletronic Architecture from Complex System Views从复杂系统观点看模块级综合集成航空电子结构
15.State-of-art and Development Trends of Power Electronics Integration Technology;电力电子集成技术的现状及发展方向
16.Design of the Multi-modules IP Cores for PWM Power Control ICs;集成PWM开关电源控制器IP核多模块化的设计
17.ON Application of Integrated Rate Mold in Electrical Engineering Efficiency Gearshift;集成功率模块在电机高效变速的应用研究
18.Research of Integration and Application for Knowledge Module Ontology of Electromechanical Product机电产品知识模块本体的集成及应用研究
相关短句/例句
integrated power electronics module (IPEM)集成电力电子模块
1.The package technology,which impacts on electrical,EMI and thermal characteristics of integrated power electronics module (IPEM),is considered as a central driver in future power electronics technology.封装技术直接影响到集成电力电子模块(Integrated Power Electronics Module,IPEM)的电气性能、EMI特性和热性能等,被公认为未来电力电子技术发展的核心推动力。
3)integrated power electronics module集成电力电子模块
1.Modeling of parasitic parameters for integrated power electronics module using flip chip technology倒装芯片集成电力电子模块寄生参数的建模
2.High performance can be obtained for the integrated power electronics module(IPEM) by using a three-dimensional packaging structure instead of a planar structure.采用三维封装结构取代传统的平面封装结构可获得高性能集成电力电子模块。
4)power semiconductor devices/integrated power electronic module电力半导体器件/电力电子集成模块
5)control system/integrated power e lectronic module控制系统/电力电子集成模块
6)hybrid integrated power electronic module混合封装电力电子集成模块
1.The problem of heat transfer from the power circuit to the driver and protection circuit printed circuit board (PCB) in a hybrid integrated power electronic module (IPEM) is investigated.采用混合封装电力电子集成模块的热模型对模块内功率电路向驱动保护电路印刷电路板(PCB)的传热进行了研究,确定了功率器件在不同的发热量下器件和驱动保护电路PCB上的最高温度。
延伸阅读
光电子集成电路光电子集成电路optoelectronicintegratedcircuit把光器件和电子器件集成在同一基片上的集成电路。简称OEIC。按功能分主要有电光发射集成电路和光电接收集成电路。前者是由电光驱动电路、有源光发射器件、导波光路、光隔离器、光调制器和光开关等组成;后者是由光滤波器、光放大器、光-电转换器以及相应的接收电路和器件集合而成。光电子集成电路从结构上可分为单片集成型和混合集成型两类。前者是把光和电功能的器件都集成在单片上;后者则侧重光学元件的集成,然后再引入相应电路的电子器件。光电子集成电路的优点是器件之间拼接紧凑,既能减弱因互连效应引起的响应延迟和噪声,从而提高传递信息的容量和高保真度,又能使器件微型化,便于信息工程的应用。