1)Electron heat-releasing电子散热
1.Electron heat-releasing becomes the bottleneck of micro-electronic industrial development with the miniaturized integration,high frequency and high speed of the electronic technologies.随着微电子技术向小型化集成化及高频高速方向发展,热流密度急剧增加,电子散热问题己成为制约微电子工业发展的瓶颈。
英文短句/例句
1.Numerical simulation on thermal performance of a novel brazed heat fin-plate for electronic devices一种新型热翅板式电子散热器的模拟研究
2.Heating Mechanism and Abstraction Measures of the Power Electron Module电力电子模块的发热机理与散热措施
3.Heat Dissipation Ability of General Cooling Technology for Electronic System电力电子设备常用散热方式的散热能力分析
4.Numerical Simulation of Electric Power and Electronic Equipment Radiator;电力电子设备水冷散热器的数值模拟
5.Research and Development on Heat Pipe Heat Sink for Power Electronic Module;热管式大功率电子模块散热器的研究与开发
6.Numerical Simulation and Experimental Study on Heat Pipe Radiator for Electronic Element;热管型电子器件散热器的数值模拟和实验研究
7.Experimental Study on Indirect Thermosyphon Radiator Coupled with Flat Heat Pipe for Electronic Component电子器件用复合热管散热器的试验研究
8.The Thermal Design Theory of Electronic Products and the Calculation of Its Area of Heat Dissipation电子产品热设计原理及其散热面积的计算
9.The electric heater radiated warmth.电热器散发出来热量。
10.Heat Transfer in Integrated Power Electronic Modules and in New Type of Plate-pin Fin Heat Sink;电力电子集成模块及新型翅柱复合型散热器的传热性能研究
11.an electric current produced between two electrodes as a result of electrons emitted by thermionic emission.一种由于热离子散射产生的电子发射而在两个电极间产生的电流。
12.The boundary conditions of scattering heat of synchronous generator are dealed with reasonaby.对发电机定子散热的边界条件作了妥善处理。
13.Mechanism of Atom Diffusion under the Heat Treatment by Big Pulse Electric Current;脉冲大电流加热条件下原子的扩散机理
14.Heat Dissipation Analysis and Design of Ultra-light Cellular Materials and Electronic Equipment;超轻多孔材料及电子设备散热性能分析与设计
15.Analysis and Test on the Forced Heat Dissipation of Rotor Disc in Eddy Current Retarder电涡流缓速器转子盘强制散热分析和试验
16.Research of Techniques and Assistant Analytical Software of Electronics Heat Elimination电子设备散热技术及辅助分析软件的研究
17.Numerical Simulation and Experimental Studies on Loop Heat Pipe Radiator for Electronic Device Cooling;电子器件回路型热管散热器的数值模拟与试验研究
18.Performance Analysis and Experimental Research on Compound Heat Pipe Radiator for Electronic Component;电子器件复合型热管散热器的性能分析与试验研究
相关短句/例句
back scatter electron背散热电子
3)heat dissipation of electronic apparatus电子器件散热
1.The miniature flat heat loop pipe (LHP) used for heat dissipation of electronic apparatus at high heat fluxes is presented, and its operational principle and advantages are analyzed.提出了微小型平板LHP来实现高热流密度电子器件的散热,分析了LHP的工作原理以及运用于电子器件散热的优点。
4)heat rejection for electronic components电子元件散热
5)electron thermal conductivity电子热扩散系数
1.The electron thermal conductivity in the HT 7 tokamak is obtained by analyzing the electron power balance.同时研究了壁处理硅化后的电子热扩散系数 。
6)valve(heat)dissipation电子管热扩散
延伸阅读
电子-电子双共振 在垂直静磁场H的方向,施加两个微波电磁场:①较弱的微波电磁场，激发电子从能级2向能级3跃迁，不致于饱和；②强的微波电磁场，激发电子从能级1向能级4跃迁，使达到饱和，从而导致能级4的电子转移至能级3，以观察反映2→3跃迁的电子自旋共振信号强度的变化，故称为电子－电子双共振。它与电子-核双共振不同之处是不涉及核的跃迁，并且观察的与电子自旋共振有关的能级和未观察的跃迁能级之间无共享的公共能级。
