1)inversion[英][?n'v?:?n][美][?n'v???n]倒装
1.Rethink over the movement and the inversion;“移位”与“倒装”再思考
2.Researches on Inversion in Rhetoric and Transposition in Grammar修辞学倒装研究与语法学易位研究
3.This article mainly discusses inversion and ellipsis,the two grammatical rhetoric techniques of an abstract writing of the medical English research paper.本文主要探讨医学论文英文摘要写作中两种主要的语法修辞手段:倒装和省略。
英文短句/例句
1.upside-down mounting倒装法 -集成电路组装的
2.We'll have to finish the jog, however long it takes.注意：这里是表语倒装和宾语倒装，主要动词没有倒装。
3.Electromigration in Sn3.0Ag0.5Cu flip chip solder jointSn3.0Ag0.5Cu倒装焊点中的电迁移
4.An Overview of Non destructive Inspection in Flip Chip Packaging倒装焊芯片封装中的非接触检测技术
5.Flip Chip will be a New Method of Packaging Technology倒装芯片将成为封装技术的最新手段
6.Bumping Technology for MEMS Flip Chip Packaging;MEMS封装中的倒装芯片凸点技术
7.Area Array Package--BGA/CSP & flip chipBGA/CSP和倒装焊芯片面积阵列封装技术
8.The technique of reversing, or inverting the normal word order of a sentence.倒装句：一种将句子正常的表达方法倒置的技巧。
9.A change in normal word order, such as the placement of a verb before its subject.倒装正常词序的变化，例如，倒装动词置于主语之前
10.Installing Roof Antenna Mast of High-rise Building by Upside-down Lifting Method倒装吊升法安装高层建筑屋顶天线桅杆
11.Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging倒装芯片封装材料—各向异性导电胶的研究进展
12.Study of the Process of the Flip Chip Package Based on Aluminum Nitride Substrate以氮化铝陶瓷为基板的倒装式封装工艺研究
13.Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;基于倒装焊接的电子封装器件热性能的研究
14.Thermal Power Plant FGD Absorber Flip Construction Technology火力发电厂烟气脱硫装置吸收塔倒装施工工艺
15.The challenger took a dive.挑战者假装被击倒.
16.a knockout feigned by prearrangement between prizefighters"职业拳击手事先安排的假装被击倒,佯倒."
17.He' s not really angry he' s just acting ( the stern father ).他倒不是真生气--只是装装（严父的）样子罢了.
18.A Research on the Alarm Unit for Backing a truck of the Container Reach Stacker and Its Application集装箱正面吊倒车报警装置的研究与应用
相关短句/例句
anastrophe[英][?'n?str?fi][美][?'n?str?f?]倒装
1.Textual functions of anastrophe from the point of view of thematic structure;从主位结构再谈倒装的语篇功能
2.This essay compares the rhetorical question and anastrophe in English and Chinese Language in rhetorical and pragmatics respect.从修辞和语用的角度,对英语中的rhetorical question,anastrophe和汉语的设问,倒装两种修辞方法,进行了比较。
3.In the course of English teaching, we have long noticed the following phenomenon: Our students can generally recognize a variety of anastrophe while reading, whereas they seldom consciously put into practice the construction while writing.在英语教学的过程中,我们早已注意到这样一种现象:我们的学生在阅读过程中,碰到形形色色的倒装时,一般都能加以辨认,但是,在自己动笔写作时,鲜有使用倒装的。
3)flip-chip倒装
1.The technologies of serf-aligning and flip-chip are adopted to develop GaN based high-power blue light emission diode(1mmx1mm).采用一种自对准制造工艺和倒装芯片的装配技术,研制出GaN基蓝光大功率发光二极管(1mm×1mm)。
4)flip-chip倒装片
1.In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.文章通过试验证明:纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
5)flip chip倒装片
1.This text introduces the technology of flip chip,from origins to the development of now,then an evaluation of the advantage in craft and electricity aspectses is made.文章主要介绍了倒装片技术从起源到现在的发展状况,并对倒装片的工艺优点及电气方面的优点作出评价,提出倒装片将成为今后大型计算机组装工艺中的关键技术。
2.The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.文章讨论了引线键合芯片与板上或有机基板上焊料凸点式倒装片的成本比较问题。
6)flip chip倒装焊
1.Thermal conductivity prediction of underfill and its affects on the flip chip temperature field;底充胶导热系数预测及对倒装焊温度场的影响
2.Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint;低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响
3.The Probabilistic Designing of the Parameters of Flip Chip Microelectronic Package;倒装焊微电子封装结构参数的概率设计
延伸阅读
倒装用颠倒词序来加强语气、协调音节或错综句法的修辞格。
