印制板,PCB英语短句,例句大全

印制板,PCB
1)PCB[英][,pi:si:'bi:][美][,pisi'bi]印制板
1.Research on Boring Path Optimization of PCB;印制板钻孔加工走刀路径优化
2.Plasma Technology and Its Application in PCB;等离子体技术与印制板生产中应用
3.Approach to the Full-automatic PCB Printing Machine;全自动印制板印刷机的探讨

英文短句/例句

1.double type printed circuit board connector双件式印制板连接器
2.sequentially-laminated mulitlayer顺序层压多层印制板
3.A ( non-removable ) printed circuit board to which other ( remov able ) printed circuit boards connect.一种(固定的)印制电路板,其它的印制板电路板就连到这块板上。
4.Analysis and Calculation of Coreless Transformer and Inductor in Printed Circuit Board;无芯印制板变压器与印制电感器的分析和计算
5.EMI Control in Design of Twolayer PCB双面印制板设计中如何控制电磁干扰
6.Printed boards--Part 10: Specification for flex-rigid double-sided printed boards with through connectionsGB/T4588.10-1995印制板第10部分:有贯穿连接的刚挠双面印制板规范
7.Test method for current proof of conductors on printed boardsGB/T7613.1-1987印制板导线耐电流试验方法
8.Test methods of thermal shock for printed boardsGB/T4677.11-1984印制板耐热冲击试验方法
9.Test method of surface insulation resistance for printed boardsGB/T4677.1-1984印制板表层绝缘电阻测试方法
10.printed circuit board portable tester印制电路板袖珍测试器
11.interlayer contact层间接触-印制电路板的
12.interlayer continuity层间连接-印制电路板的
13.an impression taken from an engraved steel plate.从钢制雕刻板上印出来的印迹。
14.Procedure and Key Technical Points of Screen Printing for Printed Circuit Board印制电路板丝网印刷工艺和技术要点
15.A print or engraving made by using such a plate.铜凹版印刷品用铜凹板印制的印刷品或版画
16.copper foil laminate铜箔叠层板-印制电路板的
17.A device used for printing, especially a photographic machine from which a duplicate of a master print can be made.晒板机或印相机印刷用的装置，尤指印相机，可以复制优秀的印刷品
18.dilal ,of paper or paperboard, printed, for self-recording apparatus印制或纸板制刻度盘,用于自动记录器

相关短句/例句

printed circuit board印制板
1.The structural design, design parameters, material chosen and manufacture process of multi-pinhole compound die of main printed circuit board for large screen color TV are introduced.介绍大屏幕彩色电视机主印制板多小孔复合模的模具结构、设计参数、材料的选用和制造工艺等。
2.The process includes: (1) activating a palladium substrate after electroless palladiumplating on the printed circuit boards; (2) then electrolessly depositing gold onto an activatedpalladium substrate.概述了印制板化学镀Pd/Au组合镀层工艺:(1)印制板化学镀Pd以后活化Pd表面;(2)在活化过的Pd表面上化学镀Au。
3.The copper circuitry surfaces of printed circuit boards (PCB) which will be electrolessly nickel plated are activated by aqueous suspension of particulate zinc metal, and then the electroless nickel plating is carried out.介绍了采用金属Zn粒子悬浮液活化要镀镍的印制板(PCB)Cu电路表面,使其可以进行化学镀镍的工艺方法,它可以克服Pd-Sn活化的缺点。
3)Printed board印制板
1.A post-treatment technics on electrolytic copper foil used for printed board;印制板用电解铜箔后处理工艺的研究
2.Hollow-core printed boards that are suitable for surface mount techuology(SMT) are bonded with two different techniques to make the two samples.本文通过对两种不同的粘接工艺的试验，对采用SMT（表面安装技术）的空芯印制板的温升进行了热性能分析和胶层厚度比较。
4)printed circuit board(PCB)印制板(PCB)
5)bare board裸印制板
6)Printed Circuit Board PCB印制板，印制电路板