1)electroless plating化学镀
1.Study on the preparation technical of Pd membrane by electroless plating on porous α-Al_2O_3 ceramic;α-Al_2O_3多孔陶瓷上化学镀Pd膜工艺研究
2.Effects of technological conditions on deposition rate and structure of functional Co-B films prepared by electroless plating;化学镀工艺对Co-B功能膜沉积速率与结构的影响
3.Fretting wear behavior of Ni-B and Ni-B/BN electroless plating;化学镀Ni-B和Ni-B/BN镀层微动磨损性能研究
英文短句/例句
1.Plating Technology and Properties of Electroless Ni-Mo-P Alloy Coatings化学镀Ni-Mo-P合金镀工艺及镀层性能
2.The Plating Ration and Life-Span Study of Acidic System and High Phosphorus Solution of Electroless Plating;酸性体系高磷镀层化学镀液镀速与寿命的研究
3.Study on the Technology of Electroless Plating and the Properties of Coating;化学镀镍及复合镀工艺与镀层性能研究
4.Magnetic cobalt-boron alloy deposits were prepared by electrolessplating.采用化学镀制得钴硼磁性合金镀层。
5.Research on the Process of Electroless Ni-P and Performance of Coating on Cr12MoV;Cr12MoV化学镀镍—磷工艺及镀层性能研究
6.Preparation of silver-coated glass fiber by electroless plating with ultrasonic treatment超声处理化学镀法制备镀银玻璃纤维
7.Recent Progress in Electroless Ni-P-SiC Composite Plating化学镀Ni-P-SiC复合镀层的研究进展
8.Preparation and characterization of electroless Ni-P-MoS_2 composite coatings化学镀Ni-P-MoS_2复合镀层的制备与表征
9.Corrosion Resistance of Three Kinds of Ni-base Alloy Electroless Plating Layer三种镍基合金化学镀镀层的耐蚀性能
10.A Study of Micro-hardness of Fe-Zn Alloy Obtained by Electroless Plating化学镀Fe-Zn镀层的显微硬度实验研究
11.Study on Properties of Electroless Nickel Plating Coating on High-Strength Aluminum Alloy高强铝合金的化学镀镍镀层性能研究
12.Study on Electroless Composite Plating and Colorization of Coating on PET Fabric;涤纶织物复合化学镀及镀层表面多彩化研究
13.The Investigation on Effect of Pickling and Activation on Electroplating and Electroless Plating on Magnesium Alloys镁合金酸洗活化对电镀化学镀影响的研究
14.Ultra Black Property of Ni-P Coating on ABS Resin by Chemical PlatingABS树脂的化学镀Ni-P镀层的超黑化性能
15.Ageing and Regeneration on Solution of Electroless Plating Composite Ni-P-Diamond化学镀镍-磷—金刚石镀液的老化与再生研究
16.Study on Direct Electroless Ni-P Alloy Plating on Magnesium Alloy into Neutral Plating Bath and Properties of Plating Layer;镁合金在中性镀液中直接化学镀Ni-P工艺及镀层性能的研究
17.Study on Process and Property of Plating of Electroless Ni B Re Alloy化学镀镍硼稀土合金镀层工艺与性能的研究
18.Research on Property of Electroless Ni-Cu-P and Composite Coating of Ni-Cu-P-Nanoparticles;化学镀Ni-Cu-P合金及其纳米粒子复合镀研究
相关短句/例句
chemical plating化学镀
1.Influence of surfactant CTAB on Co-Ni-P chemical plating;十六烷基三甲基溴化铵对化学镀Co-Ni-P的影响
2.Novel activation method using chemical plating on the fabric;应用于织物化学镀的新活化方法
3.Prepartion and characterization of chemical plating Cu - Ni - P onto carbon nanotubes;化学镀CuNiP-碳纳米管复合材料的制备与表征
3)electroless[i'lektr?ulis]化学镀
1.Study of structure and performance of electroless coating of Ni-W-P layer diamond surface;金刚石表面化学镀Ni-W-P层组织与性能研究
2.Study on the preparation of electroless Ni-P alloy plating on the surface of quartz glass;石英玻璃表面化学镀镍-磷工艺研究
3.Studies on crystallization process of electroless Ni-P deposits;化学镀Ni-P镀层晶化过程研究
4)electroless deposition化学镀
1.Magnetic Co-Ni-P alloy thin films were prepared using electroless deposition.采用化学镀制备了Co-Ni-P磁性合金薄膜,分别用能谱仪、XRD和AGM对薄膜的成分、结构和磁性进行了表征,考察了化学镀液中硫酸铵浓度对薄膜成分、结构和磁性的影响。
2.The CoWP thin films were prepared using electroless deposition process.利用化学镀的方法制备了CoWP磁性薄膜。
3.Ni-Cu-P ternary alloy was prepared on 45 steel by an electroless deposition and its microstructure,phase structure and properties were studied using optical microscope,energy dispersive analysis,X-ray diffraction and microhardness tester.对45钢表面用化学镀方法镀镍-铜-磷三元合金层,采用金相显微镜、扫描电镜能谱分析、X射线衍射和显微硬度计研究了镀层的组织、相结构和性能。
5)electroless nickel plating化学镀
1.Effects and characteristics of MgF_2 during electroless nickel plating of magnesium alloys;镁合金化学镀中预处理氟化镁膜的特征与作用
2.Study on electroless nickel plating activated without palladium on the surface of cenospheres;空心玻璃微珠表面无钯活化化学镀镍工艺研究
3.Deposition process of electroless nickel plating on magnesium alloy;镁合金化学镀镍层的生长过程
6)Chemical plating solution化学镀镀液
延伸阅读
化学镀分子式:CAS号:性质:又称非电镀。化学镀是利用合适的还原剂使溶液中的金属离子有选择地在催化剂活化的表面上还原析出成金属镀层的一种化学处理方法。在化学镀中,溶液内的金属离子是依靠得到所需的电子而还原成相应的金属。化学镀溶液的成分包括金属盐、还原剂、络合剂、缓冲剂、pH调节剂、稳定剂、加速剂、润湿剂和光亮剂等。化学镀液中采用的还原剂有次磷酸盐、甲醛、肼、硼氢化物、氨基硼烷和它们的某些衍生物等。与电镀相比,化学镀具有镀层厚度均匀,针孔少,不需要直流电源设备,能在任何外形复杂的镀件上获得均匀的镀层,可在金属、司卜金属、半导体等各种不同基材上镀覆等特点。目前,化学镀镍、铜、银、金、钴、钯、铂、金、锡,以及化学镀合金和化学复合镀层等在工业生产中已被采用。化学镀是目前国内外发展最为迅速的表面处理工艺之一。
