无压浸渗,pressureless infiltration英语短句,例句大全

无压浸渗,pressureless infiltration
1)pressureless infiltration无压浸渗
1.SiCp/Al composites with high volume fraction prepared by pressureless infiltration;无压浸渗法制备高体分比 SiCp／Al
2.The mechanical properties of B4C/Al composite prepared by pressureless infiltration technology were tested.对无压浸渗法制备的B4C/Al复合材料进行了力学性能测试。
3.%SiCp/Al composites were prepared successfully by pressureless infiltration.采用无压浸渗工艺制备出了SiC体积含量达65%的SiCp/Al复合材料,其颗粒分布均匀,试样的致密度较好。

英文短句/例句

1.The Structure and Properties of Al/SiCp Composites Preparated by Pressureless Infiltration for Electronic Packaging;无压浸渗制备Al/SiCp电子封装材料的结构与性能
2.A Study on the Bending Strength and Wear Resistance of SiC/Al Composites by Pressureless Infiltration;无压浸渗法制备SiC/Al复合材料强度和耐磨性的研究
3.Pressureless Infiltration of SiCp/Al Electronic Packaging Materials with Particles of Bimodal Size Distribution;无压浸渗制备双尺寸颗粒SiCp/Al电子封装材料的研究
4.Study on Process and Thermal Properties of Si_P/Al Composites Prepared by Pressureless Infiltration;高含量Si_P/Al热控制材料的无压浸渗工艺及热性能研究
5.Fabrication and Properties of β-SiCp/Al Electronic Packaging Material by Pressureless Infiltration;无压浸渗法制备β-SiCp/Al电子封装材料工艺与性能研究
6.Study on Technology and Properties of Al_2O_(3f)/AZ91D Composite Prepared by Pressrueless Infiltration Method;无压浸渗法制备Al_2O_（3f）/AZ91D复合材料工艺及性能研究
7.Compatibility of SiC_p/Al Composites with Titanium Alloy Integrated Synchronously by Pressureless Infiltration TechniqueTi合金与SiC_p/Al复合材料在无压浸渗同步复合过程中的相容性
8.Presureless Infiltration and Thermal-properties of SiC Porous Ceramics Reinforced Al Composites for Electronic PackagingSiC/Al基电子封装复合材料的无压浸渗法制备与热性能研究
9.The structure/ function integrating aluminium matrix composite was prepared by pressureless infiltration( a new casting technology) and the properties of the composite were tested in this paper.采用新型铸造-无压浸渗法制备了结构/能一体化铝基复合材料,并对该复合材料进行了性能测试。
10.The interfacial reactions enhance the wettability and promote the spontaneous infiltration process.界面反应的存在提高了润湿性,促进了无压自发浸渗。
11.Effect of the Reactive Additions on the SiCp/Al Composites Fabricated by the Pressureless Infiltration Technique;活性剂对无压自浸渗法制备SiCp/Al复合材料的影响
12.The FEM Simulation and Pressure Infiltration of Al_2O_3p/ZL104 Composites;压力浸渗制备Al_2O_3p/ZL104复合材料及有限元模拟
13.Fabrication and Properties of SiCp/Al Electronic Packaging Housing by Gas Pressure Infiltration;气压浸渗SiCp/Al电子封装外壳的制备与性能
14.The FEM Simulation of the Liquid Infiltration-Extrusion Process Including Damage for Composites;复合材料液态浸渗挤压有限元模拟及损伤研究
15.The FEM Simulation of the Liquid Infiltration-Extrusion Process for Composites;复合材料液态浸渗挤压过程的有限元模拟
16.Research on the FEM Simulation of the Liquid Infiltration-Extrusion Process for Fabricating MMC;液态浸渗挤压复合材料过程的有限元模拟
17.Investigation on Al/SiCp Electronic Packaging Materials Fabricated by Gas Pressure Infiltrating Processes;气压浸渗法制备Al/SiCp电子封装材料的研究
18.Manufacturing TiC/Ni_3Al Composites by Using Pressureless Melt Infiltration Processing无压熔渗法制备TiC/Ni_3Al复合材料的渗入工艺研究

相关短句/例句

pressureless infiltration无压浸渗法
1.High volume aluminum matrix composites prepared by pressureless infiltration;无压浸渗法制备高体积含量的铝基复合材料
3)pressureless infiltration无压自浸渗
1.The SiC_P/Al composite was fabricated by pressureless infiltration method.采用无压自浸渗法制备SiC颗粒增强Al基复合材料,研究了Si对SiC颗粒与Al液之间浸润性的影响。
4)Pressure-Free Infiltrated SiC/Al无压浸渗SiC/A1
1.Plating and Application of Pressure-Free Infiltrated SiC/Al;无压浸渗SiC/A1的电镀和应用
5)gas pressure infiltration气压浸渗
1.Al/SiCP electronic packaging materials embedded metal components were fabricated by gas pressure infiltration.采用气压浸渗技术完成了Al/SiCP电子封装材料嵌入金属元件的制备,应用能谱分析、XRD观察了界面层微观组织,并对界面连接强度进行了抗弯强度性能测试。
6)moulding pressure infiltration模压浸渗
1.Production technology of ZrW_2O_8/Al6013 composites prepared by moulding pressure infiltration method was introduced and the microstructure and coefficients of thermal expansion of ZrW_2O_8/Al6013 composites were studied.介绍了模压浸渗复合法制备ZrW2O8/A l6013复合材料的工艺过程,并对该复合材料的组织和热膨胀性能进行了初步探讨。