1)ultrasonic bonding超声键合
1.Experimental modeling on steady-state vibration of bonding tool in ultrasonic bonding;超声键合装置中劈刀稳态振动的试验建模
2.Development and prospect of ultrasonic bonding transducer;超声键合换能器的研究——回顾与展望
3.Study of nonlinear identification of time series of vibration on transducer in ultrasonic bonding system;热超声键合换能系统动力学特性的非线性检验
英文短句/例句
1.Design for Frequency-modulated Ultrasonic Generator in Ultrasonic Bonding Field超声键合变频式超声波发生器的设计
2.Microcosmic Mechanism and Rule of the Interfaces in Ultrasonic Bonding;超声键合界面微结构生成机理与规律研究
3.Research on Nonlinear Vibration of Contact Interface in Thermosonic Bonding Transducer System热超声键合换能系统接触界面非线性振动研究
4.Study on Interfacial Characteristics and Resistance of Electronic Device during Ultrasonic Bonding;电子器件超声键合接合部形成特征及电性能研究
5.Research on the Key Technologies of Ultrasonic-Magnetorheological Compound Finishing;超声波磁流变复合抛光关键技术研究
6.Research of Ultrasonic Power Supply in Wire Bonding Based on FPGA基于FPGA的引线键合超声电源的研究
7.Ultrasonic Bonding System Applied to the Package of Polymer Micro Parts;应用于聚合物微器件封装的超声波键合系统
8.Ultrasonic Fusion Bonding for Polymer Microfluidic Chips聚合物微流控芯片超声波熔融键合技术研究
9.Research on the Ultrasonic Bonding Method for Polymer Microfluidic Chips聚合物微流控芯片超声波键合方法研究
10.Design of High-frequency Ultrasonic Transducer for Wire Bonding and Research on Motion Control of Bond Head引线键合高频超声换能器的设计和键合头运动控制研究
11.Several Questions in Spreading EDM Combined with Ultrasonic Machining;推广超声—放电复合加工方法的几个关键问题
12.Effect of Substrate Surface Smoothness on Thin Al Wire Wedge Bonding Strength平整度对细Al丝超声引线键合强度的影响
13.Simulation and Study of Ultrasonic Vibration Propagation in Wire Bonding System超声振动在引线键合系统中的传播仿真与研究
14.Fabrication of micro energy director on polymethyl methacrylate substrate for micro ultrasonic bonding超声波键合能量引导微结构PMMA基片的制作(英文)
15.Influence of Temperature on Alignment Accuracy in the Thermosonic Flip-chip Bonding热超声倒装键合中温度对对准精度的影响
16.Study on Key Techniques of CFRP Digital Ultrasonic Inspection System;碳纤维复合材料数字化超声检测系统关键技术研究
17.Studies on Vibration Propagation and Performance Formation of Thermosonic Flip Chip Bonding Interface;热超声倒装键合界面运动与界面性能的生成规律研究
18.Design and Fabrication of Micro Energy Director on Microfluidic Chip for Ultrasonic Bonding;微流控芯片超声波键合能量引导微结构设计与工艺
相关短句/例句
ultrasonic wire bonding超声键合
1.Ultrasonic wire bonding is one of the most important technologies in chip interconnection of integrated circuits.超声键合是实现集成电路封装中芯片互连的关键技术之一。
3)Ultrasonic Wire Bond超声契键合
4)thermosonic bonding热超声键合
1.Dynamic characteristics study of piezoelectric transducer for thermosonic bonding;热超声键合压电换能器的动力学特性
2.The system of the ultrasonic transducer is the key component of the bonding equipment in the thermosonic bonding system.在热超声键合系统中,超声换能系统是键合装备的核心部分。
5)Ultrasonic wedge bonding超声楔键合
6)ultrasonic bonding超声波键合
1.Design and Fabrication of Micro Energy Director on Microfluidic Chip for Ultrasonic Bonding;微流控芯片超声波键合能量引导微结构设计与工艺
2.Ultrasonic Bonding System Applied to the Package of Polymer Micro Parts;应用于聚合物微器件封装的超声波键合系统
3.The USW of plastic used in the polymer MEMS packaging field forms a novel technology called ultrasonic bonding(USB).为了解决当前聚合物MEMS器件键合技术中存在的问题,将塑料超声波焊接技术引入聚合物微器件键合领域,从而形成了一种新的MEMS键合工艺——超声波键合。
延伸阅读
UG自定义右键弹出菜单和快捷键UG的右键弹出菜单包含了一些我们常用的功能，比如Roate、Fit等，为了使用的更加方便，我们也可以自己打造！打开UG安装目录下的UGII下的menus文件夹，里面包含了一些*.men和*.tbr，我们以文本方式打开它，发现也不难理解。例如，我们想在右键弹出菜单里面的roate和pan之间加入如图示的view下的orient功能，首先我们打开ug_main.men,查找orient，会看到下面的 BUTTON UG_VIEW_REFRESHLABEL &RefreshBITMAP refresh_window.bmpACCELERATOR F5ACTIONS STANDARDCASCADE_BUTTON UG_VIEW_EDITLABEL O&perationBUTTON UG_VIEW_ORIENTLABEL Ori&ent...ACTIONS STANDARD参考上面部分我们会看出快捷键的定义是*ACCELERATOR来指定的，我们把红色部分即BUTTON UG_VIEW_ORIENT的LABEL下面加入一行ACCELERATOR Ctrl+Alt+O(这里可以自行定义，但不要和别的重复)，保存，这样我们就把快捷键定义好了，然后我们选中红色部分复制。接着打开ug_view_popup.men，它就是右键弹出菜单的定义文件。为了把它放在roate和pan之间，我们把刚才复制的部分粘贴在下面图示的位置：TOGGLE_BUTTON UG_VIEW_POPUP_ROTATELABEL R&otateBITMAP rotate.bmpACCELERATOR F7ACTIONS STANDARDBUTTON UG_VIEW_ORIENTLABEL Ori&ent...ACCELERATOR Ctrl+Alt+OACTIONS STANDARDTOGGLE_BUTTON UG_VIEW_POPUP_PANLABEL &Pan BITMAP pan.bmpACCELERATOR F9ACTIONS STANDARD
