1)capsule[英]['k?psju:l][美]['k?psjul]封装体
1.In this paper we introduce a new modeling element:Function Block Adapter(FBA),which is responsible for the connection of UML-RT capsule and IEC 61499 function block.研究了用于连接UML-RT封装体和IEC61499功能块的模型元件:功能块适配器,它提供了同UML-RT封装体和功能块相交互的接口。
2.This paper studies the modeling element: Function Block Adapter,which responsible for the connection of UML-RT capsule and IEC 61499 function block.复杂控制系统常用UML来建模,而分布式控制系统又通常以功能块来构建,文中研究了用于连接UML-RT封装体和IEC 61499功能块的模型元件:功能块适配器。
2)crystal packaging晶体封装
3)case pakaging封装壳体
英文短句/例句
1.Study on the thixoforming of electronic packaging shell with SiC_P and Al alloy碳化硅铝合金材料触变成形电子封装壳体研究
2.Application of Low Melting Point Alloys to Processing of TC4 Case Packaging低熔点合金灌注在钛合金封装壳体加工中的应用
3.Seal and fix PES membrane in the Polycarbonate (PC) shell to form a hollow fiber membrane hemofilter.将pes膜封装固定在聚碳酸酯壳体内 ,组装成中空纤维膜血液滤过器。
4.Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuitsGB/T14862-1993半导体集成电路封装结到外壳热阻测试方法
5.solid front case with pressure relief at back后部带泄压装置的前封式外壳
6.Kiln head seal person who adopts clamshell seal, kiln tail equips with the contact-type sealinstallation of the axial, have guaranteed sealed dependability.窑头密封采用了壳罩式密封，窑尾装有轴向接触式密封装置，保证了密封的可靠性。
7.hydraulic oil pump driving device housing液压油泵传动装置壳体
8.flanged-mounted injection nozzle holder突缘安装喷油器壳体
9.The analyser is housed in an explosion-proof enclosure.分析器装在防爆壳体里。
10.epoxy seal transistor环氧树脂封装晶体管
11.Only the new device is housed in sealed water proof case.只有这种新装置才具有密封防水的外壳。
12.Fabrication and Properties of SiCp/Al Electronic Packaging Housing by Gas Pressure Infiltration;气压浸渗SiCp/Al电子封装外壳的制备与性能
13.Analysis of Welding Casing of Active Implantable Medical Devices有源植入式医疗器械外壳封装工艺分析
14.Verify that housing alignment dowels are in position before installing housing.安装壳体前先验证壳体校准销均已定位。
15.There are four translators in each package so a number of lines may be interfaced.在每个封装壳中装有4个变换器，从而可以同许多线接口。
16.Abstract: A high density packaging with superior thermal con duction and electrical performance, in which metal served as substrate or package, is introduced in this paper.文摘:以金属为外壳的封装是一种新的高密度封装技术，具有优异的导热性能及电性能。
17.At the earlier stage of eutectic, the enveloped or nor- enveloped frame austenite shell lias formed.共晶前期石墨球局围形成封闭或不封闭的框架奥氏体壳;
18.invertebrate having a soft unsegmented body usually enclosed in a shell.无脊椎动物，身体软而不分节并经常封在壳中。
相关短句/例句
crystal packaging晶体封装
3)case pakaging封装壳体
4)package[英]['p?k?d?][美]['p?k?d?]包封体，封装体
5)semiconductor packaging半导体封装
1.Time-pressure dispensing technology is widely used in semiconductor packaging.时间/压力型流体点胶技术在半导体封装过程中有着广泛的应用。
2.The snap curing oven is key equipment in the semiconductor packaging.半导体封装快速养护炉是半导体封装过程中的一个关键设备。
3.It is hard to acquire test data form variant type of semiconductor packaging test machine,because the data format of variant machine is different.针对半导体封装测试机机型多、数据文件格式不统一、数据获取难的问题,提出了一种基于虚拟机的数据获取接口技术。
6)semiconductor package半导体封装
延伸阅读
Assembly晶粒封装以树酯或陶瓷材料，将晶粒包在其中，以达到保护晶粒，隔绝环境污染的目的，而此一连串的加工过程，即称为晶粒封装（assembly）。封装的材料不同，其封装的作法亦不同，本公司几乎都是以树酯材料作晶粒的封装，制程包括：芯片切割→晶粒目检→晶粒上「架」（导线架，即lead frame）→焊线→模压封装→稳定烘烤（使树酯物性稳定）→切框、弯脚成型→脚沾锡→盖印→完成。以树酯为材料之ic，通常用于消费性产品，如计算机、计算器，而以陶瓷作封装材料之ic，属于高性赖度之组件，通常用于飞弹、火箭等较精密的产品上。
