复合钎料,composite solder
1)composite solder复合钎料
1.Effect of content of Ag particles on properties of SnCu based composite solder;Ag颗粒含量对SnCu基复合钎料性能的影响
2.Interfacial reaction of Sn-9Zn/Cu joint with Cu particle-reinforced composite solder Sn-9Zn;Cu颗粒增强的Sn-9Zn复合钎料/Cu钎焊接头界面反应
3.Study on nanon-sized Ag particles enhanced composite solder;纳米银颗粒增强复合钎料的研究
英文短句/例句

1.Vacuum Brazing Aluminum Matrix Composites with Low Melting Point Solder Development真空钎焊用低熔点铝基复合钎料的研制
2.Microstructure and Residual Mechanical Property of Thermomechanically-Fatigued Composite Solder Joints;复合钎料钎焊接头热疲劳显微组织与残余力学性能研究
3.Creep rupture and enhancement mechanism of Ag particle-enhancement composite solder jointsAg颗粒增强复合钎料钎焊接头蠕变断裂及强化机理研究
4.Study on Clearance Filling Ability and Interfacial Structure of 316L Stainless Steel Brazed Joint Using BNi-2+BNi-5 Composite FillerBNi-2+BNi-5复合钎料钎焊不锈钢填缝能力及其组织性能研究
5.Study on preparation and characteristic of low melting-point Aluminum base composite filler metal低熔点铝基复合钎料的制备及其性能研究
6.Research of New Sn-Ag Based Lead-free Composite Solders Containing Nano-structured Reinforcements纳米结构强化的新型Sn-Ag基无铅复合钎料
7.Study on Cu-based Filler Metal Brazed Composite Coating with Particle Reinforced;铜基钎料钎焊颗粒增强复合涂层的研究
8.Brazed Interface Microanalysis of Carbon-fiber Reinforced Composite Material and Titanium Alloy by Brazing Filler Metal Containing Ti Element含Ti钎料钎焊碳纤维复合材料与钛合金的界面微观分析
9.A Study of the Creep Property of Sn-9Zn Solder and Its Strengthen;Sn-9Zn钎料蠕变性能及其复合增强研究
10.Research on the Ultrasonical Brazing of 55VOL.%SiC_p/A356 Composites;55vol.%SiC_p/A356复合材料超声钎焊工艺研究
11.Brazability of SiC Particulate Reinforced Aluminium Metal Matrix CompositesSiC颗粒增强铝基复合材料的钎焊性
12.Argon gas atmosphere furnace brazing of SiC_p/101Al compositesSiC_p/101Al复合材料的氩气保护炉中钎焊
13.Ultrasonically aided brazing of SiCp/A356 compositesSiC_p/A356复合材料超声波辅助钎焊
14.Microstructure and Properties of Vacuum Brazing C_f/C Composites Using Reactive Al Based Filler Metals铝基活性钎料真空钎焊C_f/C复合材料焊接接头的组织及性能
15.Microstructure and shear strength of solder joints of SiC_p/Al composites with Ni plating with Sn-2.5Ag-2.0Ni solderSnAgNi钎料钎焊Ni镀层SiC_p/Al复合材料的接头微观结构及剪切性能
16.Joining of C_f/SiC Composite to Ti Alloy using AgCuTi-W Composite Filler MaterialsC_f/SiC复合材料与Ti合金的AgCuTi-W复合钎焊
17.Brazing of C_f/SiC composite to Ti alloy using Ag-Cu-Ti-TiC composite filler materialsC_f/SiC复合材料与Ti合金的Ag-Cu-Ti-TiC复合钎焊
18.Technologies of Composite Bonds of Al_(18)B_4O_(33w)/Al Composites by Ultrasonic Brazing;Al_(18)B_4O_(33w)/Al复合材料超声钎焊焊缝复合化工艺
相关短句/例句

lead-free composite solder无铅复合钎料
1.Morphology evolution of intermetallic compounds in nickel particle reinforced lead-free composite solder;Ni颗粒增强无铅复合钎料中IMC形态之演变
3)Sn-58Bi lead-free solderSn-58Bi复合无铅钎料
4)particle reinforced composite lead-free solder颗粒增强复合钎料
5)composite-brazing复合钎焊
1.In this paper, we succeeded in bonding Si 3N 4 ceramic to LDZ125 superalloy by composite-brazing technology in which Ag-Cu-Ti and new Ni-base alloys were assembled in Si 3N 4/LDZ125 joint simultaneously.本文采用复合钎焊新工艺,将新型Ni基钎焊合金与Ag-Cu-Ti合金同时置入接头中,实现了Si3N4陶瓷与LDZ125高温合金的钎接,解决了Ni基钎焊合金不能直接钎焊Si3N4陶瓷的困难。
6)insert and button complex-type bits复合钎头
1.The insert and button complex-type bits and the new-typetapered rods show mighty power;复合钎头暨新型钎杆显现强劲生命力
延伸阅读

钎料分子式:CAS号:性质:为实现两种材料(或零件)的结合,在其间隙内或间隙旁所加的填充物。钎料的熔点必须比焊接的材料熔点低。适宜于连接精密、复杂、多铤缝和异类材料的焊接。钎料按熔点高低分为软钎料(熔点低于450℃的钎料),硬钎料(熔点高于450℃的钎料)。钎料按组成分软钎料有锡基、铅基、锌基等钎料。硬钎料有铝基、银基、铜基、镍基等钎料。