环氧胶,epoxy adhesive
1)epoxy adhesive环氧胶
1.Modification of curing agent and accelerator for one component epoxy adhesive;单组分环氧胶固化剂及促进剂的改性研究
2.Study on strengthen epoxy adhesive cured at high temperature with glass fibre;玻璃纤维对高温固化环氧胶的增强作用研究
3.Effect of silica on strength of epoxy adhesive;SiO_2对环氧胶粘剂强度的影响
英文短句/例句

1.Synthesis of novel curing agent for epoxy resin and epoxy adhesive新型环氧树脂固化剂的合成及其环氧胶粘剂
2.Effect on toughening epoxy adhesive with polysulfide rubber聚硫橡胶对环氧胶粘剂的增韧作用研究
3.Preparation of HMVC-NBR and Its Application in the Heat-Resistance Epoxy Adhesives羧基丁腈橡胶的制备及在耐温环氧胶中的应用
4.Study on erosion resistant nano epoxy adhesive coating环氧胶粘纳米涂层冲蚀磨损性能研究
5.CURING PROPERTIES OF ENR/NBR BLENDS环氧化天然胶/丁腈胶共混物硫化条件的研究
6.Studies on High Damping NR/ENR Blends;减震天然橡胶/环氧化天然橡胶共混物的研究
7.Study on SiO_2/Epoxy Resin Hybrid Materials by Means of Sol-Gel;溶胶—凝胶法制备SiO_2/环氧树脂杂化材料的研究
8.Study on Preparation of SiO_2/Epoxy Resin Coating by Sol-Gel Method;溶胶—凝胶法制备SiO_2/环氧树脂涂料的研究
9.Determination of gelation time of epoxide resinsGB/T12007.7-1989环氧树脂凝胶时间测定方法
10.epoxy pouring sealant for high-voltage focusing potentiometer高压聚焦电位器环氧灌封胶
11.Chlorine dioxide microcapsules were prepared withβ- CD and chlorine dioxide.用β环糊精制备了二氧化氯微胶囊。
12.Modified Polyvinyl Formal Cement Adhesive by Epoxy Resin环氧改性聚乙烯醇缩甲醛水泥胶粘剂
13.The Study on High-performance Structural Adhesive of Epoxy Resin for Architecture;高性能环氧型建筑结构胶粘剂的研制
14.The Research on the Aging Resistant Performance and Improvement of Epoxy Structural Adhesive;环氧结构胶的耐老化性能及改性研究
15.Study on the Epoxy Resin Adhesive Modified by Polyimide聚酰亚胺改性环氧树脂胶粘剂的研究
16.The Study on Epoxy Adhesive Used in the Heat Exchanger换热器粘接用环氧树脂胶粘剂的研究
17.Study on novel tackifier for RTMRTM环氧树脂用新型定位胶黏剂的研制
18.Determination of the Residual Ethylene Oxide in Weishu Capsules by GCGC法测定胃舒胶囊中环氧乙烷残留量
相关短句/例句

epoxy resin adhesive环氧胶
1.The epoxy resin adhesives composited with multi-walled carbon nanobutes(MWCNTs) curing at room temperatue were prepared by solution blend process using different diameter of CNTs and different weight percents of CNTs.应用三辊研磨、超声等手段将多壁碳纳米管(MCNT)与CH6型室温固化环氧胶直接共混,制得了碳纳米菅环氧复合胶。
3)Epoxy resin环氧胶
1.A new epoxy resin hardener system was developed by hydroxymethyl reaction and Mannich reaction of fatty amine and mixture of catalyst.采用活性稀释剂和无机碱性填料,可使低成本的糠叉丙酮改性环氧胶能在低温(0~5℃)固化,并且在潮湿或水下环境中具有较高的粘接强度和抗压强度,加入适当的有机硅可使其具有较低的吸水性。
2.Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made. 分析了功率型LED热阻系统的构成,对采用银浆和环氧胶作为芯片键合材料的功率型LED热阻进行了对比研究。
4)epoxy silica gel环氧硅胶
1.In the concentrated sulfuric acid conditions, silica gel confined ionic liquids could be prepared by the reaction of N-methylimidazoe with alkyl epoxy silica gel, which was synthesized by silica gel as solid support and KH-560 as the coupling agent.以硅胶为载体,KH-560为偶联剂合成了烷基硅烷化环氧硅胶,再与N-甲基咪唑在浓硫酸作用下制备硅胶固定化离子液体。
5)epoxy film adhesive环氧胶膜
1.Study on one-component epoxy film adhesive curable at moderate temperature;中温固化单组分环氧胶膜的研究
6)epoxy adhesive环氧胶层
延伸阅读

DAD导电环氧胶分子式:CAS号:性质:是以环氧树脂、固化剂、增韧剂和导电银粒子配制成的导电胶黏剂,可以分成单组分型和多组分型,根据固化温度还可以分成室温固化胶、中温固化胶和高温固化胶。银粒子抗氧化能力强,制成的导电胶稳定性较好。其电阻率在(1~5)×10-4Ω·cm之间。广泛用于各种电子设备中电子器件的胶接。