SU-8胶,SU-8 photoresist
1)SU-8 photoresistSU-8胶
1.Study on dimensional precision of UV-lithography on SU-8 photoresist;SU-8胶紫外光刻的尺寸精度研究
2.With the application of neural network,process parameters of negative SU-8 photoresist were optimized in terms of internal stress.根据基片曲率法的原理,通过三因素三水平的正交实验,测量了9组不同工艺条件下SU-8胶层内应力的大小。
3.Thermal swelling of SU-8 photoresist and its mechanism were investigated.对SU-8胶的热溶胀效应及其机理进行了研究,在现有微模具的UV-LIGA工艺的基础上,利用AN-SYS对SU-8胶的热溶胀性规律进行了仿真分析。
英文短句/例句

1.Research on Theory and Experiment of UV-Lithography on SU-8 Photoresist;SU-8胶紫外光刻理论与实验研究
2.Research of SU-8 Resist Lithography Using Ultraviolet Laser;紫外激光曝光光刻SU-8胶的工艺研究
3.Fundamentals and Lithographie Technology Based on Pulse Laser Exposing SU-8 Photoresist;脉冲激光曝光SU-8胶的基础与光刻技术研究
4.Study on the Interfacial Binding Property and Ultrasonic Aging of SU-8 Photoresist by Molecular Dyniamics SimulationSU-8胶界面结合性及超声时效的分子模拟研究
5.Design and Machining Process Simulation of Precision Milling Machine for SU-8 PhotoresistSU-8胶膜精密铣床设计及加工过程仿真
6.Experimental Study on Ultrasonic Stress Relief Used in SU-8 Photoresist;SU-8光刻胶超声时效的实验研究
7.Studies on the Microfabrication Technology for Production of Microfluidic Chips Based on SU-8 Negative Photoresis;基于SU-8负光胶的微流控芯片加工技术的研究
8.Fabrication and Dimensional Control of Nickel Mould Based on SU-8 Thick Photoresist Techniques;基于SU-8厚胶镍模具制作及其尺寸精度控制研究
9.An Out-Of-Plane Eletro-Thermal Polymer Actuator;聚合物基(SU-8)面外运动电热微驱动器
10.Basic Research on Electro-Optic Switch Based on Poled Polymer DR1/SU-8基于极化聚合物DR1/SU-8的电光开关基础研究
11.Micro integrated pressure,temperature,and relative humidity sensor using adhesive bonding with SU-8应用SU-8粘合技术的微型压力、温度和湿度集成传感器(英文)
12.The establishment of hybridoma SU-2000 secreting McAb against human glioma,and the Purification of the detected antigen;抗人脑胶质瘤单克隆抗体SU-2000的建立及其识别抗原的提取
13.I have eight rolls of film and a bar of chocolate.How much is it altogether?8卷胶卷和1条巧克力,共多少钱?
14.Breeding and Selection of Desirable Rubber Clone Reyan 8-79橡胶树优良品种热研8-79的选育
15.Durable polyvinyl to prevent water penetration.8 times thicker than ordinary plastic bags. Ideal for multiple uses.采用耐用胶,比一般胶袋厚8倍,有效防止渗水,可重复使用。
16.Preparation and Characteristics of α-(8-QLO) PcZn Polymer Nanomicellesα-(8-QLO)PcZn聚合物纳米胶束的制备及其特性研究
17.Baryon Spectrum in the Chiral SU(3) Quark Model;在手征SU(3)夸克模型下研究重子谱
18.Nonclassical Effect of the Superposed State of Su(2) s Odd and Even Q-Coherent States;SU(2)q-奇偶相干叠加态的非经典效应
相关短句/例句

SU-8 resistSU-8胶
1.The development process of the high resolute and high aspect ratio microstructure with SU-8 resist on the metal substrate was discussed, and the development rule of resist with different graphic feature and thicknesses from 120-340 μm was analysed.突破了传统深宽比概念,提出金属基底上基于图形特征的光刻胶显影技术,对采用SU-8胶加工高分辨率和高深宽比微结构的显影工艺进行了讨论,分析了120~340μm厚具有不同图形特征的SU-8胶显影规律,认为在同样条件下,凸型图形显影效果优于凹型非连通性图形;曲线型显影效果优于直线型图形与点状图形;圆弧连接的图形显影效果优于尖角型图形。
2.In this paper,UV-LIGA technology was investigated to fabricate the ultra-high micro electrode array,and the micro electrochemical machining was used as an aided method to remove the SU-8 resist.采用UV-LIGA技术制作超高金属微细阵列电极,并利用电解置桩的方法辅助去除SU-8胶
3)SU-8 removalSU-8去胶
4)SU-8 Thick PhotoresistSU-8厚胶
1.Fabrication and Dimensional Control of Nickel Mould Based on SU-8 Thick Photoresist Techniques;基于SU-8厚胶镍模具制作及其尺寸精度控制研究
5)SU-8 photoresistSU-8光刻胶
1.Three-dimension photonic crystals fabrication using SU-8 photoresist;SU-8光刻胶制作三维光子晶体
2.Effect of post exposure bake temperature on thermal swelling of SU-8 photoresist;后烘温度对SU-8光刻胶热溶胀性及内应力的影响
3.By the method,the nickel micro-electroforming pattern was directly made on a metal substrate by a low-cost UV-LIGA surface micro-fabrication process using the negative thick SU-8 photoresist to form the microinjection mold.介绍了一种新颖的微注塑模具的制作方法———无背板生长法,它是利用负性厚SU-8光刻胶,通过低成本的UV-LIGA表面微加工工艺,直接在金属基板上电铸镍图形而制作完成的。
6)SU-8 photoresist moldSU-8胶印模
1.Processes of SU-8 photoresist mold and polymer elastomeric stamp were researched in order to solve the technology of the key part—elastomeric stamp in the soft-lithography.为了解决软光刻技术中核心元件弹性印章的制备技术,对SU-8胶印模和聚合物弹性印章进行了工艺研究。
延伸阅读

Su分子式 C4H4O3分子量 100.07CAS号 108-30-5 琥珀酸酐为白色斜方形棱状结晶。熔点119.6℃。相对密度d204=1.2340。溶于乙醇、氯仿和四氯化碳,微溶于水和乙醚。其沸点随压力不同而变化。 用途;琥珀酸酐是重要的有机合成中间体。在医药工业上主要用于合成氯霉素琥珀酸酯钠(Chloramphenicol sodium succinata)、羟孕酮琥珀酸酯钠、氢化可的松琥珀酸酯钠等。