µç×Ó±³É¢ÉäÑÜÉä(EBSD),EBSDÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
µÈδã»ðÇòÄ«ÖýÌú,austempered ductile ironÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¿ª¿Ú¶È,openingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÖáÀà¼þ,shaftÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Èý×ø±ê²âÁ¿,CMMÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ïÛÏ÷¼Ó¹¤,boringÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
µ¹½Ç,ChamferÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
·ÖÁ¿,ComponentÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
²,foilÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
°×¿Ú,chillÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Õôѹ¸ª,autoclaveÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
½ðÊôѧ,MetallographyÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
΢×éÖ¯,microstructureÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¸ßÎÂÈä±ä,high temperature creepÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
´Ö¾§ÈÈÓ°ÏìÇø,CGHAZÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÊÊÅäÐÔ,suitabilityÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Ëõ¾¶Ðýѹ,neck-spinningÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ºóÖô¦ÀíÆ÷,postprocessorÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Ãæ°å,panelÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¼·Ñ¹¼Ó¹¤,extrusionÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
µõ¾ß,spreaderÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
·ÇÖ¦¾§,non-dendriteÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Áµ¶Íä,camberÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÕÞ²æ,crossingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Ì×ÁÏ,nestingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Àë,gallingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÔÙÁ÷º¸,Reflow solderingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Ô¤¶Æ,pre-platingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
·ÇÕý½»,nonorthogonalÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¹¤ÒÕ²¹³äÃæ,addendumÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÎÞÐò̬,disorderedÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÓÐÐò̬,orderedÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Cr(¢ó),chromium(¢ó)Ó¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Âö³åµçÁ÷´¦Àí,electropulsingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Çжϻú,cutterÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÆóÒµ»¯,industrializationÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Ê®°ËÍé»ù°·,OctadecylamineÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÕÕÏà,photographyÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
V·¨ÔìÐÍ,V-processÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
UV-LIGA¼¼Êõ,UV-LIGA technologyÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Ôþ²Û,grooveÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÐÞÄ¥,grindingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
·æÀûÐÔ,sharpnessÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¿É¶ÍÐÔ,forgeabilityÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¸±³µ¼Ü,subframeÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÒëÂë,DecodingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
·þÒÛ,ServiceÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¹Õ½Ç,cornerÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÐÞÈñ,dressingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÐÄÖá,mandrelÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
´ø¼«,stripÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ƵÆ×ͼ,spectrumÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ӡѹ,indentationÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÏäÐÍÁº,box girderÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¶à²ÉÑùÂÊ,multirateÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
µç´ÅÌú,electromagnetÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
³åÈû,pluggingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
×ÔÓúÐÔ,Self-healingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Ë«Öá,biaxialÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¹â»úµçÒ»Ì廯,opto-mechatronicsÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ʧÎÈÆðÖå,wrinklingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÄÉÃ×Y2O3,nano-Y2O3Ó¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Óê¹ÎÆ÷,WiperÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
²Ã¼õ,tailoringÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÇòÕ¤ÕóÁзâ×°,BGAÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÒíƬ,VaneÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Àâ׶,pyramidÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
È«ÈÕÖÆ,Full-timeÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
бÅöײ,oblique impactÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
µÍºÏ½ð,Low AlloyÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ǯ¹¤,fitterÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Ô¤ÀÉì,Pre-stretchingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
΢ϸµçÖý,micro-electroformingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ҺѹÕÍÐÎ,hydroformingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Òí×Ó°å,fenderÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
³¬¸ßÇ¿,ultra-high strengthÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¼ôÈÐ,bladeÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Íø¸ñÖع¹,re-meshingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Èý×ø±ê,Three-coordinateÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¶ÏºóÉ쳤ÂÊ,percentage elongation after fractureÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Æ«ÐÄ,eccentricityÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Çò¸ËÒÇ,double-ball-barÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
µ²Äà°å,fenderÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
жÁÏ,dischargeÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Á÷±ä³ÉÐÎ,RheoformingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ԤĤ,prefilmingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
΢¹ÛÖ¯¹¹,microtextureÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
¸ÉÇÐÏ÷,dry cuttingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
³å²Ã¼þ,blanking partÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
±Ðμþ,cupÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÀäÀ,cold drawingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÁªÖáÆ÷,CouplingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÀÁÑ,crackÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Äø-Á×,Ni-PÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Sb,antimonyÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
ÂýÓ¦±äËÙÂÊÀÉì,slow strain rate tensionÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
µÈ¾¶µÀ½Ç¼·Ñ¹,ECAEÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
³äÒºÀÉî,hydrodynamic deep drawingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
Ó¦±äʱЧ,strain agingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
×°¼Ð,clampingÓ¢Óï¶Ì¾ä,Àý¾ä´óÈ«
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